Multidipping Technique for Fabrication Time Reduction and Performance Improvement of Solution‐Processed Single‐Walled Carbon Nanotube Thin‐Film Transistors

Hyeonggyu Kim,Jiseok Seo,Narkhyeon Seong,Seunghwan Lee,Sooyeon Lee,Taehoon Kim,Yongtaek Hong
DOI: https://doi.org/10.1002/adem.201901413
IF: 3.6
2020-02-28
Advanced Engineering Materials
Abstract:We implement a simple and effective technique, "multi‐dipping technique," to rapidly form random networks of single‐walled carbon nanotubes (SWCNTs) used as a channel material in solution‐processed thin‐film transistors (TFTs). The multi‐dipping process consists of repetition of dipping a substrate into a dispersed semiconducting SWCNT solution and rinsing the substrate between each dipping process. Compared to the conventional dipping method, this technique reduces total deposition time required to form high quality SWCNT networks by more than half and simultaneously improves the electrical performances of SWCNT TFTs. We also comprehensively analyze these phenomena with experiments and microscope images of the channel region, which well show morphology of the SWCNT networks. We believe that our low‐temperature process and facile deposition method of SWCNT networks could provide a guideline for high‐throughput fabrication of high performance SWCNT TFT arrays in flexible active matrix sensor array and display applications.This article is protected by copyright. All rights reserved.
materials science, multidisciplinary
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