High-Purity Copper Structures from a Perfluorinated Copper Carboxylate Using Focused Electron Beam Induced Deposition and Post-Purification

Luisa Berger,Jakub Jurczyk,Katarzyna Madajska,Thomas Edward James Edwards,Iwona Szymańska,Patrik Hoffmann,Ivo Utke,Iwona Szymańska
DOI: https://doi.org/10.1021/acsaelm.0c00282
IF: 4.494
2020-06-12
ACS Applied Electronic Materials
Abstract:The electron-induced modification of volatile physisorbed metal–organic molecules is the key process in focused electron beam induced deposition (FEBID). In this work, the perfluorinated copper carboxylate [Cu<sub>2</sub>(μ-O<sub>2</sub>CC<sub>2</sub>F<sub>5</sub>)<sub>4</sub>], (Cu<sub>2</sub>(pfp)<sub>4</sub>), was implemented in FEBID, as it has the highest metal-to-carbon ratio Cu/C = 1:6 compared to other Cu precursors used so far. FEBID was obtained within a small temperature window of 120–130 °C. Transmission electron microscopy verified the presence of metal(oxide) nanocrystals within a carbonaceous matrix. The chemical composition analysis revealed the loss of about 80% of ligand material during the electron-induced dissociation. The copper nanocrystals oxidized within a few minutes in films &lt;80 nm upon exposure to ambient conditions, while they were protected by a carbon–fluorine-containing matrix in thicker areas of the deposits. A two-step post-growth annealing procedure with subsequent oxidizing and reducing atmosphere was used to purify the deposits. Pure copper crystals were formed in this step.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsaelm.0c00282?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsaelm.0c00282</a>.The file contains an explanation of the beam diameter determination, backscattered electron yields, and the FFT of <a class="internalNav" href="#fig1">Figure </a><a class="internalNav" href="#fig1">1</a>d (<a class="ext-link" href="/doi/suppl/10.1021/acsaelm.0c00282/suppl_file/el0c00282_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,engineering, electrical & electronic
What problem does this paper attempt to address?