A SAP-Capable Electroless Copper Plating Procedure Deploying Palladium-Free Activation

André Beyer,Laurence J. Gregoriades,Stefan Kempa,Julia Lehmann,Yvonne Welz,Andre Beyer
DOI: https://doi.org/10.1109/impact50485.2020.9268546
2020-10-21
Abstract:Electroless copper plating on various materials, including SAP-relevant substrates, was conducted by using a recently developed procedure involving palladium-free activation. The plating performance of this procedure was assessed by measuring the thickness, coverage, adhesion and electrical reliability of the electroless copper deposit and by comparing the results of these measurements with those obtained for a reference system in which an established process based on ionic palladium was used. The results presented herein demonstrate that the palladium-free system performed as well as the palladium-based reference process.
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