Preparation of Electric and Magnetic Ps@Ni@Cu Core-Shell Microspheres for Anisotropic Conductive Films

Hu Wang,Xulian Hu,ZhaoXi Zhou,Qihui Chen,Maochun Hong,Heqing Fu

DOI: https://doi.org/10.2139/ssrn.4062515

2022-01-01

SSRN Electronic Journal

Abstract:Successfully designed and synthesized PS@Ni@Cu core-shell composite microspheres, which provide efficient electronic transmission for anisotropic conductive films for electronic packaging. Herein, a simple method for preparing core-shell composite microspheres using Pickering emulsion polymerization as a template, a dense nano-nickel shell layer was coated on the surface of polystyrene to obtain PS@Ni microspheres, the microspheres have conductivity and magnetic properties, and then reduced by electroless plating on the microspheres to obtain a nano-copper layer to enhance the mobility of electrons in a specific medium. Finally, the microspheres were compounded in epoxy resin to achieve directional (horizontal, oblique, vertical) movement under the force of a magnetic field to form an anisotropic conductive film. The conductivity is 171.68 S·cm -1 , the adhesiveness and conductivity of the film can be changed by adjusting the content of microspheres. The film has excellent thermal stability, good adhesion, and anisotropic conductivity. The conductivity difference between the conductive direction and the insulating direction is about 10 8 orders of magnitude, and it can adapt to strong acids and alkalis and other more extreme environments. It is significance to the development of electronic packaging and is expected to be widely used in the field of electronic devices.