Synergy improvement of dielectric properties and thermal conductivity in PVDF composites with core‐shell structured Ni@SiO2

Ting Li,Wenying Zhou,Ying Li,Dan Cao,Yun Wang,Guozheng Cao,Xiangrong Liu,Huiwu Cai,Zhi-Min Dang
DOI: https://doi.org/10.1007/s10854-020-05149-x
2021-01-10
Abstract:Developing a high dielectric constant (<i>ε</i><sub>r</sub>) polymer dielectrics with low dielectric loss and high thermal conductivity (TC) is still continuous demands for advanced electrical power systems. Herein, nickel (Ni) particles were encapsulated by silica (SiO<sub>2</sub>) via a sol–gel process using sodium silicate as a precursor, and the obtained core–shell Ni@SiO<sub>2</sub> powders were blended into poly(vinylidene fluoride) (PVDF) to investigate the effects of SiO<sub>2</sub> insulating layer and its thickness on dielectric properties and TC of composites. Compared with pristine Ni, the Ni@SiO<sub>2</sub>/PVDF composites exhibit a superior <i>ε</i><sub>r</sub>, and remarkably suppressed loss and conductivity, attributable to the SiO<sub>2</sub> interlayer between the core Ni particles which effectively prevents them from direct contacts and significantly reduces the leakage loss. Moreover, the Ni@SiO<sub>2</sub>/PVDF composites still possess a high TC owing to the restrained thermal interfacial resistance and enhanced interfacial compatibility between the fillers and the matrix. The developed Ni@SiO<sub>2</sub>/PVDF composites with high <i>k</i> and TC but low loss are potential for microelectronic industry.
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