Abstract:Hybrid fillers to build an efficient thermal conductivity network. Traditional integrated circuit (IC) packaging materials and printed circuit board substrate materials suffer from several limitations including low thermal conductivity, high coefficient of thermal expansion (CTE), and poor dielectric properties. Although significant efforts have been made to enhance these properties, achieving a single composite system with simultaneous high thermal conductivity, extremely low CTE, and dielectric loss remains a formidable task. In this study, we propose a hybrid polymer composite system that addresses these challenges. Our approach involves utilizing a thermosetting polyphenylene oxide (PPO) as the resin matrix, while incorporating boron nitride (BN) sheets with high thermal conductivity and alumina (Al2O3) spheres with favorable fluidity as fillers. To optimize the composite properties, the filler surfaces are modified using dopamine and silane coupling agents, ensuring proper interface control. The composites exhibit significant improvements in thermal conductivity, reduced dielectric loss and CTE, while maintaining excellent processibility. Specifically, with a composition of 25 vol% BN and 25 vol% Al2O3, the thermal conductivity of the composite reaches 2.18 W·m−1 K−1, surpassing neat PPO resin by a factor of 10.9. Simultaneously, the CTE decreases from 2.27% to 1.18% between 50 and 260°C, and the dielectric loss reduces from 0.0024 to 0.0011 at 10 GHz, as compared to neat PPO resin. Highlights The reported novel hybrid composite offers a promising solution to the limitations of traditional IC packaging materials. The reported hybrid composite exhibits significantly improved thermal conductivity, ultralow dielectric loss, and reduced coefficient of thermal expansion, while maintaining excellent processibility. The thermal conductivity of the composites reaches 2.18 W·m−1 K−1, surpassing that of the neat resin by a factor of 10.9, meanwhile the dielectric loss is as low as 0.0011 at 10 GHz, which is extremely difficult to achieve simultaneously for thermosetting polymer composites. Synergetic effects were realized with the hybridization of fillers with different dimensionality, and proper filler surface modification.

Synergistic Improvement of Dielectric and Thermal Conductivity Properties for Polymers Filled with Multifunctional Modified Nanowires

Enhanced Thermal Conductivity and Microwave Dielectric Properties by Mesostructural Design of Multiphase Nanocomposite

Enhanced Dielectric Properties of Polyvinylidene Fluoride Nanocomposites Via Calcium Copper Titanate Nanofibers

Carbon Nanotube Filled Polymer-Based Dielectric Composites With High Dielectric Constant

Polymer Composites Filled with Core@double-Shell Structured Fillers: Effects of Multiple Shells on Dielectric and Thermal Properties

Polymer Composite with Enhanced Thermal Conductivity and Insulation Properties through Aligned Al2O3 Fiber

Improving electromagnetic engineering of thermal conductive composites by establishing continuous thermal conductive networks with gradient impedance

Dielectric polymer composites with ultra-high thermal conductivity and low dielectric loss

Polyphenylene oxide/boron nitride–alumina hybrid composites with high thermal conductivity, low thermal expansion and ultralow dielectric loss

Optimizing the dielectric properties of polymer composites by constructing multi-dimensional fillers

Enhancement of dielectric properties by modulating electroactive -phase of copper doped nickel oxide nanoparticles incorporated thin film

Epoxy nanocomposites with high thermal conductivity and low loss factor: Realize 3D thermal conductivity network at low content through core-shell structure and micro-nano technology

Synergistic effect of carbon fiber and alumina in improving the thermal conductivity of polydimethylsiloxane composite

Decoupling of inter-particle polarization and intra-particle polarization in core-shell structured nanocomposites towards improved dielectric performance

Enhancing dielectric property and multi-interface polarization of poly(vinylidene fluoride)/Ni-embedded CaCu 3 Ti 4 O 12 fibers composites tailored by magnetic field

Enhanced high-temperature energy storage properties of polymer composites by interlayered metal nanodots

Carbon Nanotube Array/Polymer Core/Shell Structured Composites with High Dielectric Permittivity, Low Dielectric Loss, and Large Energy Density

Particle packing theory guided multiscale alumina filled epoxy resin with excellent thermal and dielectric performances

Enhanced Thermal Conductivity of Polypropylene/polyamide 6 Composites Via Optimizing the Selective Distribution of H-Bn and NH2-CNTs Hybrid Fillers Within the Co-Continuous Structure

Synergy improvement of dielectric properties and thermal conductivity in PVDF composites with core‐shell structured Ni@SiO2

Improving through-plane thermal conductivity of PDMS-based composites using highly oriented carbon fibers bridged by Al2O3 particles