Abstract:The incorporation of high-dielectric permittivity ceramic or conductive fillers into the polymer is an effective method to obtain flexible high-performance dielectric materials, but it is still a huge challenge to achieve a balance between dielectric and mechanical properties. In this paper, we report a polyvinylidene fluoride (PVDF) nanocomposite based on a novel crab leg-like filler, in which Ag nanoparticles (AgNPs) were decorated on the surface of polydopamine (PDA)-coated silicon carbide (SiC) nanowhiskers (NWs). Compared with the nanocomposites with as-received SiC, this PVDF/SiC@PDA@Ag nanocomposites exhibited significantly suppressed dielectric loss (0.03 at 1 kHz) and leakage current. The Argant plot (ε′\documentclass[12pt]{minimal}\usepackage{amsmath}\usepackage{wasysym}\usepackage{amsfonts}\usepackage{amssymb}\usepackage{amsbsy}\usepackage{mathrsfs}\usepackage{upgreek}\setlength{\oddsidemargin}{-69pt}\begin{document}$${\varepsilon }^{^{\prime}}$$\end{document}- ε″\documentclass[12pt]{minimal}\usepackage{amsmath}\usepackage{wasysym}\usepackage{amsfonts}\usepackage{amssymb}\usepackage{amsbsy}\usepackage{mathrsfs}\usepackage{upgreek}\setlength{\oddsidemargin}{-69pt}\begin{document}$${\varepsilon }^{\prime\prime}$$\end{document} curve) and electric modulus analysis demonstrated that the inhibition of the organic layer of PDA to interface polarization and the coulomb-blockade effect of AgNPs hindered carrier transport, which resulted in the largely suppressed dielectric loss. Furthermore, while the dielectric properties were improved, the PVDF/SiC@PDA@Ag nanocomposites also exhibited excellent mechanical and thermal conductivity. Ultimately, the nanocomposites prepared via this method are promising for applications in microelectronic devices.Graphical abstract

SiC@SiO2 Core@shell Filler Reinforced Polymer Composites with High Dielectric Permittivity and Low Loss

Concurrently Enhanced Dielectric Properties and Thermal Conductivity in PVDF Composites with Core-Shell Structured Β-Sicw@sio2 Whiskers

Investigation of Electrical and Thermal Properties of Epoxy Resin/Silicon Carbide Whisker Composites for Electronic Packaging Materials

Polymer composites filled with core–shell structured nanofillers: effects of shell thickness on dielectric and thermal properties of composites

Significantly Enhanced Dielectric Performances and High Thermal Conductivity in Poly(vinylidene fluoride)-Based Composites Enabled by SiC@SiO2 Core-Shell Whiskers Alignment

Enhanced dielectric constant and concurrently suppressed dielectric loss of PVDF composites incorporating BaTiO3@SSCNT@SiO2 core@double-shell structured fillers

Decoupling of inter-particle polarization and intra-particle polarization in core-shell structured nanocomposites towards improved dielectric performance

Interface modified Si@SiO2/PVDF composite dielectrics with synchronously ameliorative dielectric and mechanical properties

Improved Dielectric Properties and Thermal Conductivity of PVDF Composites Filled with Core–shell Structured Cu@CuO Particles

Core@double-shell structured fillers for increasing dielectric constant and suppressing dielectric loss of PVDF-based composite films

Enhanced thermal conductivity for polydimethylsiloxane composites with core-shell CFs@SiC filler

Synergy improvement of dielectric properties and thermal conductivity in PVDF composites with core‐shell structured Ni@SiO2

Core-Shell Engineering of Conductive Fillers Toward Enhanced Dielectric Properties: A Universal Polarization Mechanism in Polymer Conductor Composites

Core‐Shell Engineering of Conductive Fillers towards Enhanced Dielectric Properties: Universal Polarization Mechanism in Polymer Conductor Composites

Engineering of core@double-shell Si@SiO 2 @PS particles towards improved dielectric performances: Filler domain-type polarization mechanism in PVDF composites

Realizing enhanced dielectric and mechanical performance of polyvinylidene fluoride/SiC nanocomposites through a bio-inspired interface design

Flexible BaTiO3/SiC@PbTiO3/epoxy composite films with enhanced dielectric performance at high frequency

Chain-Like Semiconductive Fillers for Dielectric Enhancement and Loss Reduction of Polymer Composites

Polymer Composites Filled with Core@double-Shell Structured Fillers: Effects of Multiple Shells on Dielectric and Thermal Properties

PVDF reinforced with core–shell structured Mo@MoO3 fillers: effects of semi-conductor MoO3 interlayer on dielectric properties of composites

Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide