Inkjet‐Printed Ternary Oxide Dielectric and Doped Interface Layer for Metal‐Oxide Thin‐Film Transistors with Low Voltage Operation

Liam Gillan,Shujie Li,Jouko Lahtinen,Chih‐Hung Chang,Ari Alastalo,Jaakko Leppäniemi
DOI: https://doi.org/10.1002/admi.202100728
IF: 5.4
2021-05-26
Advanced Materials Interfaces
Abstract:<p>Additive solution process patterning, such as inkjet printing, is desirable for high-throughput roll-to-roll and sheet fabrication environments of electronics manufacturing because it can help to reduce cost by conserving active materials and circumventing multistep processing. This paper reports inkjet printing of Y<i><sub>x</sub></i>Al<sub>2−</sub><i><sub>x</sub></i>O<sub>3</sub> gate dielectric, In<sub>2</sub>O<sub>3</sub> semiconductor, and a polyethyleneimine-doped In<sub>2</sub>O<sub>3</sub> interfacial charge injection layer to achieve a thin-film transistor (TFT) mobility (μ<sub>sat</sub>) of ≈1 cm<sup>2</sup> V<sup>−1</sup> s<sup>−1</sup> at a low 3 V operating voltage. When the dielectric material is annealed at 350 °C, plasma treatment induces low-frequency capacitance instability, leading to overestimation of mobility. On the contrary, films annealed at 500 °C show stable capacitance from 1 MHz down to 0.1 Hz. This result highlights the importance of low-frequency capacitance characterization of solution-processed dielectrics, especially if plasma treatment is applied before subsequent processing steps. This study progresses metal-oxide TFT fabrication toward fully inkjet-printed thin-film electronics.</p>
materials science, multidisciplinary,chemistry
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