Abstract:A numerical modeling study, based on 3D finite element method (FEM) simulation and 1D analytical solutions, has been carried out to evaluate the capabilities of two ac methods for measuring in-plane thermal conductivity of thin film deposited on the back of a suspended SiNx membrane setup. Two parallel metal strips are present on the top of the dielectric membrane. One strip (S1) serves as both heater and thermometer, while another one (S2) acts as thermometer only. For a modified phase shift (MPS) method, it is crucial to extract the in-plane thermal diffusivity from the phase shift of the temperature oscillation on S2. It was found that the frequency window for carrying out the data fitting became narrower as the in-plane thermal diffusivity of the composite membrane (<math>α∥,C</math>) increased, primarily due to the failure of the semi-infinite width assumption in the low frequency region. To ensure the validity of the method, the upper limit of <math>α∥,C</math> should not exceed ~1.8 × 10−5 m2 s−1 for the specific membrane dimension under consideration (1 × 1 mm2). On the other hand, inspired by a modified Ångström method proposed by Zhu recently, we suggest a new data reduction methodology which takes advantage of the phase shift on both S1 and S2 as well as the amplitude on S1. Based on the simulation results, it is expected that the non-ideality associated with the three "observables" may be at least partially canceled out. Therefore, the frequency window selection for carrying out the data fitting is not sensitive to the magnitude of <math>α∥,C</math> and the upper limit of measurable <math>αC,∥</math> can be further increased with respect to the MPS method. For typical specimen films whose in-plane thermal conductivity ranges from 0.84 W m−1 K−1 to 50 W m−1 K−1, the method proposed here yields a theoretical measurement uncertainty of less than 5%.

The Error Analysis of a Steady-State Thermal Conductivity Measurement Method With Single Constant Temperature Region

Thermal conductivity measurement of phase-change material near melting point based on perturbation method

Principle of Measuring Thermal Conductivity Based on Steady-state Method

A Computational Method to Solve for the Heat Conduction Temperature Field Based on Data-Driven Approach

Analysis of Multi-Factor on Measurement Improvement of an Infrared Imager in Low-Temperature Environments

A high-precision method to measure thermal conductivity of solids using reversible heat flux

The Boundary Induced Error on the Measurement of Thermal-Conductivity by Transient Hot-Wire Method

Numerical modeling of in-plane thermal conductivity measurement methods based on a suspended membrane setup

Simulating Error Due to Acquired Thermoelectric Inhomogeneity

Analysis of radiation effect on thermal conductivity measurement of semi-transparent materials based on transient plane source method

Analysis of errors in the evaluation of parallel transient hot wire measurements by means of line heat source fits

Simultaneous measurements of high-temperature total hemispherical emissivity and thermal conductivity using a steady-state calorimetric technique

A Theoretical Study on MEMS-Based Thermal Conductivity Sensor

Analysis of Transient Thermal Stress in Cylindrically Orthotropic Tubes

A Steady-State Measurement System for Total Hemispherical Emissivity

Estimating Error of Measuring Thermal Conductivity Using a T-Type Nano Sensor

Infrared Radiometry Based Steady-State Method for Thermal Conductivity Measurement

Reliable Measurements of the Seebeck Coefficient on A Commercial System

Near-field radiation analysis and thermal contact radius determination in the thermal conductivity measurement based on SThM open-loop system

Automatic Algorithm Applied for Calculating Thermal Conductivity by Transient Plane Source Method

Analysis and Improvement of the Hot Disk Transient Plane Source Method for Low Thermal Conductivity Materials