Abstract:We have attempted to apply the computer-based finite element analysis (FEA) method to accurately measure the mechanical properties (e.g., hardness and elasticity) of a soft material by an indentation test. First, an axisymmetric model has been developed using commercially available FEA code ANSYS. The FEA model consisted of a thin Al-film resting on Si-substrate. A spherical indenter has been used to indent the Al-film, which traveled a predefined depth during the loading and unloading cycles. First, numerical simulations were conducted to get the force vs. displacement plot, which was later used to determine the modulus of elasticity and hardness of Al-film. The effects of substrate modulus and indentation depth were thoroughly investigated to determine the modulus and hardness of Al-film. The effect of friction, considered at the interface of indenter and Al-film, was found to offer minimum impact for relatively small indentation depth. The induced force on the Al-film by the indenter has been found to be higher with increasing indentation depth when friction was considered. However the contact stiffness, represented by the slope of the unloading curve, has been found almost the same with and without considering friction. The variation of substrate modulus has been found to be ineffective to capture the Al-film modulus for relatively small indentation depth. However for higher indentation depth, the substrate modulus has been found to offer profound effect to capture the film modulus. The hardness of the Al-film has also been found to be relatively unaffected with variation of substrate modulus. However, the hardness of the Al-film has been found to be higher with friction for relatively high indentation depth. Results obtained from this preliminary research are important to continue further investigation and to characterize the mechanical properties of other soft-materials, e.g., biofilms to minimize its detrimental effects and utilize its favorable aspects in industrial and biomedical applications.

Measuring the Elastic Modulus of Soft Thin Films on Substrates

Measuring elastoplastic properties of thin films on an elastic substrate using sharp indentation

Study of Elastic Modulus and Yield Strength of Polymer Thin Films Using Atomic Force Microscopy

Effects of surface energy and substrate on modulus determination of biological films by conical indentation

Accurate measurement of thin film mechanical properties using nanoindentation

Measuring the elastic modulus and residual stress of freestanding thin films using nanoindentation techniques

Determination of elastic moduli of polymeric materials using microhardness indentation

Measuring Thin Film Elastic Modulus Using A Micromachined Cantilever Bending Test by Nanoindenter

Nano-Indentation for Characterizing Mechanical Properties of Soft Materials

Effective Young's Modulus Measurement of Thin Film Using Micromechanical Cantilever Sensors

Correction of Substrate-Induced Thin-Film Modulus Deviations in Nanoindentation Measurements

Identification of Elastic-Plastic Material Parameters from Pyramidal Indentation of Thin Films

Identifying the Viscoelastic Properties of Soft Matter from the Indentation Response of a Hard Film-Soft Substrate System

Relationship of Stiffness-Based Indentation Properties Using Continuous-Stiffness-Measurement Method

Simultaneous measurement of the Young's modulus and the Poisson ratio of thin elastic layers

In Situ Nanoindentation Mechanical Property of Films by Atomic Force Microscope

Spherical indentation on biological films with surface energy

Elastic Property Characterization of Soft Substrate-Supported Thin Films Using Multiscale Digital Image Correlation

Determining Young’s modulus of MEH-PPV film by fitting the unloading curve

Indentation of pre-deformed compressible soft electroactive layer on substrate

Determining the Elastic Modulus of Thin Films Using a Buckling-Based Method: Computational Study