Magnetic Field Optimization and High-Power Discharge Characteristics of Cylindrical Sputtering Cathode
Li Ti-Jun,Cui Sui-Han,Liu Liang-Liang,Li Xiao-Yuan,Wu Zhong-Can,Ma Zheng-Yong,Ricky K. Y. Fu,Tian Xiu-Bo,Paul K. Chu,Wu Zhong-Zhen
DOI: https://doi.org/10.7498/aps.70.20201540
IF: 0.906
2021-01-01
Acta Physica Sinica
Abstract:High-power pulsed magnetron sputtering (HiPIMS) can produce high density and high adhesion coatings due to the high ionization. However, industrial application of HiPIMS is limited because of the unstable discharge and small deposition rate. A cylindrical cathode, developed on the basis of hollow cathode effect, can improve the discharge stability. With the development of electromagnetic systems, the plasma transport is improved, and thus increasing the deposition rate significantly. However, the introduction of electromagnetic system leads the strong discharge and large etching area on the target to be incompatibly controlled. In this work, the distribution of the tangential and longitudinal magnetic field on the target surface are improved by adding external magnets, and their effects on the plasma discharge are studied. By optimizing the magnets, the tangential magnetic field on the target surface becomes stronger and more uniform. Meanwhile, the peak of the longitudinal magnetic field increases from 73 to 96 mT and the peak location expands to two-sides of the cathode. The simulation result shows that the target etching area described by the proportion of the target area with the tangential magnetic field intensity higher than 40 mT increases from 51% to 67%, and the HiPIMS discharge studied by the particle in cell/Monte Carlo collision (PIC/MCC) method and plasma global model shows that the ion current and spectral intensity are significantly enhanced, exhibiting a doubled Cr density of 2.6 x 1020 m-3 and an increased ionization from 90% to 92.1%. The practical Ar/Cr HiPIMS discharge is carried out separately with the original and optimized cylindrical cathode, and the results reveal that the brightness of plasma glow, the target current and the etching area all increase after the improvement. Furthermore, the ion current and the optical emission spectrum suggest that the flux of ions arriving at the substrate is approximately doubled, which means that an about doubled deposition rate of the optimized cathode is achievable.