Direct Phase-Change Cooling of Vapor Chamber Integrated With IGBT Power Electronic Module for Automotive Application

Yiyi Chen,Bo Li,Xuehui Wang,Xin Wang,Yuying Yan,Xiang Li,Yangang Wang,Fang Qi,Helong Li

DOI: https://doi.org/10.1109/tpel.2020.3031372

IF: 5.967

2021-05-01

IEEE Transactions on Power Electronics

Abstract:In electric vehicles and hybrid electric vehicles, insulated-gate bipolar transistor (IGBT) power module trends to dissipate higher heat flux due to increased power rating and reduced package size. An inefficient cooling method will result in stringent thermal reliability problems. Therefore, there is a strong need for innovative and efficient cooling technologies in order to tackle these issues. In this article, a localized direct phase-change cooling strategy is applied and integrated with direct bonded copper in IGBT power module. Vapor chamber with light weight, high thermal conductivity, and even temperature uniformity replaces original copper baseplate. Layers of thermal grease and original cooling plate are removed, leading to a further reduction in thermal resistance. In order to evaluate the new module, a thermal model and an experiment were built to analyze temperature distribution in layers, junction temperature, temperature uniformity, and thermal resistance. Results indicate the integrated thermal management system outperforms traditional cooling solutions on the cooling capacity. Improvements on junction temperature, temperature uniformity, and total thermal resistance are 34.6%, 76.6%, and 41.6%, respectively. The results illustrate the potential of phase-change cooling by vapor chamber. It provides a new perspective in the compact and efficient design of power electric modules.

engineering, electrical & electronic

What problem does this paper attempt to address?

### Problems Addressed by the Paper

The paper primarily explores the thermal management issues of IGBT power modules in electric vehicles (EV) and hybrid electric vehicles (HEV). With the increase in power density and the reduction in package size, the heat flux density of IGBT modules continues to rise, making traditional cooling methods insufficient for efficient heat dissipation. Therefore, the study proposes a new direct phase-change cooling strategy and integrates it into the IGBT power module to address these thermal challenges.

Specifically, the study employs a lightweight and highly thermally conductive vapour chamber to replace the original copper baseplate and removes the original thermal grease and cooling plate, thereby further reducing thermal resistance. Experimental results show that this new thermal management system significantly outperforms traditional cooling solutions in terms of cooling capacity, particularly improving junction temperature, temperature uniformity, and total thermal resistance by 34.6%, 76.6%, and 41.6%, respectively. This achievement provides a new perspective for the design of efficient and compact power electronic modules.