Investigation on the interfacial microstructure and mechanical properties of the W-Cu joints fabricated by hot explosive welding

Kaiyuan Liu,Pengwan Chen,Chun Ran,Qiang Zhou,Jianrui Feng,Xuekun Fan,Lei Zhu

DOI: https://doi.org/10.1016/j.jmatprotec.2021.117400

IF: 6.3

2022-02-01

Journal of Materials Processing Technology

Abstract:The welding of thick W onto Cu, with good bonding, has been a big challenge due to the big differences in physical properties between W and Cu. Among various novel methods, explosive welding is the promising one to produce bimetals with large size and great thickness. However, the cracking of brittle W under high strain rate limits its application. In this work, hot-explosive welding technique was explored to overcome this problem. A 2 mm thick W plate was preheated to 500 ℃ and was successfully welded with pure Cu plate, without any cracks formed in W layer. The result suggests that preheating W to over its dynamic ductile-to-brittle transition temperature and decreasing the imported kinetic energy are two most important factors for the successful welding of thick W plate. The weldability window calculated using the parameters at 500 °C predicted the formation of a good wavy interface. The microstructures at W-Cu interface were characterized by optical microscope, SEM, EBSD and TEM. The mechanically mixed W-Cu phase and the 2∼6 nm thick amorphous layer along the interface created strong bonding between the immiscible W and Cu. The measured interfacial compressive shear strength reached 188 MPa, indicating a good bonding strength of the interface.

materials science, multidisciplinary,engineering, manufacturing, industrial