Microstructure and physical properties of Cu-2.3Ni-0.5Si alloy with thermo-mechanical treatment

Dong-Mei Liu,Cong-Shuai Yin,Yan-Hong Hua,Dong-Lin Zhang,Yu-Ao Li,Bo-Jie Ma,Xiu-Chen Zhao,Hao-Feng Xie,Li-Jun Peng,Guo-Jie Huang,Xu-Jun Mi
DOI: https://doi.org/10.1007/s12598-022-02109-8
IF: 6.318
2022-12-20
Rare Metals
Abstract:本文对比研究了Cu-2.3Ni-0.5Si合金经室温和液氮温度轧制后,及在后续时效过程中合金微观组织、硬度和电导率的变化。合金经热轧和固溶处理后,分别进行室温和液氮温度轧制,变形量均为80%,随后进行时效热处理。结果表明:室温轧制样品经450 °C时效2小时后,合金硬度达到峰值(HV 5 234),此时合金电导率为39.9% IACS;液氮温度轧制样品经450 °C时效1 h后,合金硬度达到峰值(HV 5 221),此时合金电导率为36.9% IACS。对比可知,相比室温轧制,液氮温度轧制样品达到峰值硬度需要较短的时效时间或较低的时效温度。这是因为液氮轧制样品具有较高的变形储能,这进一步增加了后续时效过程中第二相析出和晶粒再结晶的驱动力。
materials science, multidisciplinary,metallurgy & metallurgical engineering
What problem does this paper attempt to address?