Surface Oxidation Engineering for Enhanced Interface Bonding Achieving Excellent Electronic Properties in Multilayer Nitrogen Doped Graphene/cu Composites Wires

Lining Fan,Huishun Shao,Wei Chen,Zhiwen Ding,Hui Zheng,Xiaoxiao Guo,Peng Zheng,Liang Zheng,Yang Zhang
DOI: https://doi.org/10.1016/j.coco.2024.102139
IF: 8
2024-01-01
Composites Communications
Abstract:Graphene/Cu composites have attracted significant research attention due to their exceptional electrical conductivity and ampacity. However, the growth of high-quality graphene on curved copper surfaces remains challenging due to the poor wettability between Cu and C. This study presents a novel approach for the in-situ growth of nitrogen-doped graphene/Cu composite wire utilizing copper wire surface oxidation and microwave plasma heating. Nitrogen defects and CuO nanoparticles enhance the Cu-C interface, promoting uniform graphene growth, efficient electron transfer and Joule heat dissipation. Consequently, the composite wire demonstrates a 10.4 % improvement in electrical conductivity and a 48.6 % increase in ampacity. The finite element simulation was employed to investigate the primary mechanisms underlying ampacity enhancement and thermal failure in nitrogen-doped graphene/Cu wire. This work offers a promising strategy for improving the grapheneCu interface, paving the way for advanced composite wires with superior electrical properties.
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