A Novel Method for Online Junction Temperature Monitoring of Power Module Based on In-situ Sensor Fabrication

Ruiting Ke,Zhiyuan Hu,Jianfeng Tao,Zhuoqing Yang,Chengliang Liu
DOI: https://doi.org/10.1109/tpel.2024.3485997
IF: 5.967
2024-01-01
IEEE Transactions on Power Electronics
Abstract:Online monitoring of junction temperature ( $T_{j}$ ) in power modules is crucial for enhancing the performance and reliability of systems. However, existing methods for $T_{j}$ monitoring face several challenges, including device aging, lack of universality, and intrusive damage. To solve these difficulties, this study innovatively proposes a monitoring method based on the in-situ fabrication of temperature sensors. Sensors are directly fabricated between the chip and the upper copper layer of the direct bond copper (DBC) board. This approach can apply to various chips demonstrating exceptional universality. It eliminates the need to open the case, with data transmission achieved through bonding wires. After that, the proposed method requires a low sampling rate and narrow range, thus allowing for cost-effective online monitoring. Furthermore, the paper establishes a temperature differential model ( $\Delta T$ ) caused by the difference between the sensor's actual in-situ and theoretical locations. Through experimental validation, the sensor's steady-state characteristics, transient response, and effectiveness in online monitoring are confirmed. The results affirm that in-situ fabricated sensors achieve great performance in online $T_{j}$ monitoring.
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