Dynamical Junction Temperature Online Extraction With Thermal Sensitive Electrical Parameters for High Power IGBT Modules

ZHU Chongchong,WANG Xiang,LUO Haoze,ZHOU Yu,YANG Huan,LI Wuhua,HE Xiangning
DOI: https://doi.org/10.13334/j.0258-8013.pcsee.160821
2017-01-01
Abstract:The junction temperature monitor for insulated gate bipolar transistor (IGBT) modules is of great importance for reliability issues in the voltage-source-converters. How to achieve dynamical junction temperature online extraction is significantly challengeable in the power electronics community. In this paper, a MW-level practical operation reappearance test benchmark with H-bridge topology was constructed, which can test many different work conditions in the real power conversion systems. Furthermore, the turn-off delay time was employed as a thermal sensitive electrical parameter for the dynamical junction temperature extraction. And the relationship among the turn-off delay time, junction temperature of IGBT module and collector current was established. The 3-D database was built by the experimental results from the operation reappearance test bench. Furthermore, the IGBT junction temperature variation with load frequency change is also studied to show that the turn-off delay time is an excellent candidate for dynamical junction temperature online extraction due to its high sensitivity, fast response and easy integration.
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