High-Speed Electrodeposition of Low-Stress Copper-Diamond Composite Coatings on Ceramic Substrate for Reliability Improvement in Power Device Packaging

Pengfei Su,Qing Wang,Mingxiang Chen
DOI: https://doi.org/10.1109/icept63120.2024.10668528
2024-01-01
Abstract:Direct copper plated (DPC) ceramic substrates have been widely used for power device packaging due to their outstanding thermal performance. For deep UV LEDs., thick copper dams with a thickness of more than 400 μm are usually prepared on the substrate surface to achieve hermetic packaging. However, under the influence of high heat flux, the sharply increased stress mismatch between the substrate and the thick copper coating becomes prominent, and the substrate inevitably suffer from serious reliability problems such as warping and cracking. On account of these deficiencies, this study presented a low-stress copper-diamond composite material by high-speed electrodeposition. The composite coatings were prepared using a new-style electrodeposition solution formula at a high electrodeposition rate of 90 μm/h. The diamond particles were well embedded in the copper matrix without interfacial defects. The coefficient of thermal expansion (CTE) (9.44 × 10 −6 /°C) and the warping value (0.124%) were reduced by 46% and 78%, respectively, compared with pure copper coatings. The thermal conductivity (TC) reached as high as 572 W/(m.K). The high-speed electrodeposited copper-diamond composites can simultaneously improve the thermal performance and reduce the inner stress of the thick coating, which is an ideal structure coating material for enhancing the packaging reliability of power devices.
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