Abstract:With the trend of integrating structure and function of electron device, there is an urgent need to develop new thermal management materials that have good mechanical and excellent thermal properties . In this study, a sandwich-like composite film with good thermal conductivity was fabricated by utilizing vacuum hot pressing technology, to combine graphite films (upper and lower layers) and copper with embedded diamonds (middle layer). Diamonds were embedded in copper films that were then brought into contact with graphite films, which established interconnected structure between the graphite and copper films. To enhance the interfacial bonding of graphite and copper, a complete and dense WC coating was deposited on the surfaces of the graphite films and diamonds. This study delved into the effects of this interconnection structure on the thermophysical properties of the composite films. Diamonds served as connecting bridges between the upper and lower graphite films, and they were examined by micromorphological characterization. When the sintering pressure was 20 MPa, the composite film with 30 vol% diamond attained a flexural strength of 125 MPa. Notably, the in-plane thermal conductivity of the composite film reached a peak value of 780 W/(m·K), and the out-of-plane thermal conductivity achieved a maximum of 211 W/(m·K). This translated to approximately 20 % and 200 % increments in the in-plane and out-of-plane thermal conductivities, respectively, in comparison to samples lacking interconnected structures. The enhancement of the heat dissipating efficiency within the composite films was simulated and analyzed using the acoustic mismatch model (AMM). In summary, an efficient approach was developed to implement interconnected structures in composite films. The methodology developed in this study holds potential for enhancing thermal conductivity in various applications.

Effects of Diamond Content on the Thermal Conductivity of Copper Matrix Composite Materials Prepared by Cold Spraying

Effects of Cold Spraying Process and Diamond Addition on Microstructure and Thermal Conductivity of Copper Matrix Composites

Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating

Preparation and thermal conductivity of tungsten coated diamond/copper composites

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

Fabrication of diamond/copper composite thin plate based on a single-layer close packed diamond particles network for heat dissipation

Net-shape forming process for diamond-copper composites with high thermal conductivity

Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages

Microstructure of Cu-diamond Composites with Near-Perfect Interfaces Prepared Via Electroplating and Its Thermal Properties

Effect of structural modification on the thermophysical properties of graphite films/diamond sandwich copper thermally conductive composite film

High Thermal Conductive Cu-diamond Composites Synthesized by Electrodeposition and the Critical Effects of Additives on Void-Free Composites

Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials

Preparation and Characterization of Diamond/Cu Composites

Optimization of External and Internal Conditions for High Thermal Conductive Cu-diamond Composites Produced by Electroplating

Synergetic effect enabling high thermal conductivity in Cu/diamond composite

High thermal conductivity of diamond/copper composites produced with Cu–ZrC double-layer coated diamond particles

RETRACTED: Cr-Diamond/Cu Composites with High Thermal Conductivity Fabricated by Vacuum Hot Pressing

Preparation of high thermal conductivity copper–diamond composites using molybdenum carbide-coated diamond particles

Effect of Hot-Pressing Pressure on the Microstructure and Thermal Conductivity of Copper/Ti-Coated Diamond Composites

High thermal conductive copper/diamond composites: state of the art

A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites