Understanding and Engineering the Perovskite/Organometallic Hole Transport Interface for High-Performance P–i–n Single Cells and Textured Tandem Solar Cells

Shaojie Yuan,Kaitian Mao,Fengchun Cai,Zhengjie Zhu,Hongguang Meng,Tieqiang Li,Wei Peng,Xingyu Feng,Weiwei Chen,Jiahang Xu,Jixian Xu
DOI: https://doi.org/10.1021/acsenergylett.4c01301
IF: 22
2024-01-01
ACS Energy Letters
Abstract:To address challenges in perovskite solar cells integrated with textured silicon, we developed a multilayer structured hole transport layer (HTL) on the basis of organometallic copper phthalocyanine (CuPc): N,N,N ',N '-tetra[(1,1 '-biphenyl)-4-yl](1,1 ':4 ',1 ''-terphenyl)-4,4 ''-diamine (TaTm)/CuPc/Al2O3. Thermally evaporated CuPc provides stability and desired wettability for the perovskite solution. We identified a unique surface-bulk recombination pattern at the CuPc/perovskite interface that results in a high fill factor (FF = 87%) but a low open-circuit voltage (V-oc) due to surface recombination losses. TaTm enhances electron blocking, while Al2O3 forms a porous insulator contact that mitigates nonradiative recombination. Double-sided optimization of CuPc with TaTm and Al2O3 effectively reduced the surface recombination without compromising the carrier extraction efficiency. This HTL structure achieved PCE values of 22.5% and 24.5% for 1.65 and 1.54 eV perovskite in p-i-n single cells and 28.9% in textured silicon/perovskite tandem cells. The conformal and wettable HTL structure promotes uniform perovskite coating, thereby reducing issues, such as pyramid puncturing, on textured Cz-Si wafers from production lines.
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