Abstract:Pixel crosstalk resulted by the inherent Lambertian radiation of LED chips significantly hiders the quality of mini/micro‐LED display devices. Fully enclosed composite micro/nano‐package structure and in situ nanoimprint technology is proposed in this paper. By composite micro/nano‐packaging, the divergence angle of the single pixel decreases to 72°, and the light‐extraction efficiency increases 18.4%. Micro/mini‐light emitting diode (LED) arrays are regarded as the most promising next generation of display devices. However, the inherent Lambertian radiation of LED chips results in a significant pixel crosstalk. To improve the display quality, high‐quality micro/mini‐LED display pixels with fully enclosed composite micro/nano‐packages and in situ nanoimprint technology are proposed and demonstrated in this work. The nanoimprint template is designed as a composite structure comprising an intermediate sandwich cavity array and thin‐bottom nanostructure layer. Contact is maintained between the template and LED chips array substrate. By vacuuming the sealed sandwich cavities, the thin‐bottom nanostructure layer is deformed to drive the upward protrusion of the liquid optical polymer. Moreover, the nanocavities on the thin nanostructure layer are fully filled by the polymer, forming a composite micro/nano‐package. The characteristics of the composite micro/nano‐package, such as the aperture and protrusion height, can be flexibly adjusted by changing the template structure or process parameters. A 6 × 8 array LED chips display device enclosed by a composite micro/nanopackage is developed. The divergence angle of the single LED chip decreases to 72° from the original 138°, the light‐extraction efficiency increases18.4%, and the luminescence spectrum and current‐voltage characteristics changes only minimally.

Using Stacked Inverse-Reflective Cup Structure to Improve Vertical Light Output and Ambient Contrast Ratio of Light Emitting Diode Display Device

Direct Design of Thin and High-Quality Direct-Lit LED Backlight Systems

Investigation of Enhanced Ambient Contrast Ratio in Novel Micro/Mini-LED Displays

Ultra-Thin Design of Large Backlight Module Used in Illuminating Advertising Pictures

41‐2: A Patterned Packaging Scheme of MiniLED Tiled Display with HighTransmittance and High Color Consistency in Light and Dark States

Double-layer Printed White Organic Light-Emitting Diodes Based on Multicomponent High-Performance Illuminants

Wide heart-shaped mini-LEDs without a second lens as a large area, ultra-high luminance, and flat light source

Design of Optical Structure for Chip-on-board Wafer Level Packaging LEDs

A sandwich structure of multi-chip COB LED with double flat glass boards coated with phosphors film by screen printing technique

Enhancing the contrast and power efficiency of organic light-emitting diodes using CuPc/TiOPc as an anti-reflection layer

Fully Enclosed Composite Micro/Nano‐Package for High‐Quality Micro‐LED Display Pixels and In Situ Nanoimprint Technology

Direct-type Backlight Design for Extended Source Based on Irradiance-Segmentation-Feedback

Alleviating the Crosstalk Effect Via a Fine-Moulded Light-Blocking Matrix for Colour-Converted Micro-Led Display with a 122% NTSC Gamut

Vertically Stacked Rgb Leds With Optimized Distributed Bragg Reflectors

Preparation of Dome-Shaped SiO$_\text{2}$/Al$_\text{2}$O$_\text{3}$ Composite-Patterned Sapphire Substrate for High-Performance Mini-LED Backlight Modules

A Cylindrical Tuber Encapsulant Geometry for Enhancing Optical Performance of Chip-on-Board Packaging Light-Emitting Diodes

Led Package with Dome/Side-Emitting-Enhancement Silicone Lens Achieved by Dispensing and Geometry Transferring

Design and Optimization of a Partial Integrated Backlight Module

Design and Optimization of Dot-Pattern for Large Scale LED Backlight Unit

Improving the External Quantum Efficiency of High-Power GaN-Based Flip-Chip LEDs by Using Sidewall Composite Reflective Micro Structure

Advancing LED technology: the FDCSP element's breakthrough in mini and micro-LED packaging and backlight module enhancement