Abstract:The development of microelectronics requires high performance interlevel dielectric materials with an extremely low dielectric constant and loss factor. Benzocyclobutene (BCB)-based materials have attracted significant attention because of their low-dielectric constant, low loss factor, and excellent high-temperature performance. The Dow chemical company has developed a series of BCB photoresists for interlevel dielectrics based on 1,3-bis[2-(1,2-dihyd-benzocyclobutene-4-yl) vinyl]-1,1,3,3-tetramethyldisiloxane (DVS-BCB). However, the introduction of a BCB group to prepare BCB resins requires expensive noble metal catalysts such as Pd salts for the Heck reaction or Suzuki reaction. Herein, a simple but novel synthetic route for the hydrolysis and condensation of BCB-functionalized chlorosilane (BCS) to obtain 1,3-bis(1,2-dihydro-benzocyclobutene-4-yl)-1,3-dimethyl-1,3-divinyldisiloxane (DBDVS) was developed. Similarly, BCB-functionalized chlorosilane as the BCB precursor can also react with silanols or alcohols such as 1,3-adamantanediol to afford 1,3-bis[(1,2dihydro-benzocyclobutene-4-yl) methylvinylsilyloxy]adamantane (AdaDBDVS), which provides a method for the BCB functionalization of hydroxyl-containing organic or inorganic surfaces. The cured DBDVS and AdaDBDVS exhibit high glass transition temperatures above 380 degrees C and good thermal stability (T-5% > 440 degrees C). Moreover, the crosslinking density of the cured DBDVS and AdaDBDVS is higher than that of the cured DVS-BCB. Thus, the cured DBDVS and AdaDBDVS exhibit better thermal mechanical properties such as higher modulus and higher glass transition temperature. In addition, the cured DBDVS exhibits a low CTE of 47.8 ppm per degrees C from 30 to 275 degrees C as well as an extremely low dissipation factor of 0.00045 at 1 MHz, which is lower than that of cured DVS-BCB.

Double-decker Silsesquioxane-Doped Benzocyclobutene Functionalized Siloxane Polymer for Low K Materials

Low dielectric silsesquioxane-modified benzocyclobutene composites

Benzocyclobutene-functionalized Hyperbranched Polysiloxane for Low-K Materials with Good Thermostability

Multibenzocyclobutene Functionalized Silane for Low-k Polyarylsilane Thermosets with Low Coefficient of Thermal Expansion and High Thermostability

Multi-benzocyclobutene Functionalized Siloxane Monomers Prepared by Piers-Rubinsztajn Reaction for Low-K Materials

Hydrolysis and condensation of a benzocyclobutene-functionalized precursor for the synthesis of high performance low-K polymers (vol 7, pg 14406, 2017)

Highly Thermal Conductive Benzoxazine‐epoxy Interpenetrating Polymer Networks Containing Liquid Crystalline Structures

Benzocyclobutene organosiloxane resins prepared by alcoholysis of BCB functionalized chlorosilane for highly crosslinked low-k thermosets

Synthesis, Thermal and Mechanical Properties of Benzocyclobutene-Functionalized Siloxane Thermosets with Different Geometric Structures

Synthesis, Properties of Novel Benzocyclobutene-Functionalized Siloxane Thermosets

A Low Dielectric Constant Material Synergized by Calix[4]arene and Benzocyclobutene Units

Study of benzocyclobutene-functionalized siloxane thermoset with a cyclic structure

Adamantyl-based benzocyclobutene low-k polymers with good physical properties and excellent planarity

Thermally Stable, Flame Retardant, Low‐dielectric Constants, and Flexible Thermosetting Resins Based on a Tetra‐functional Benzoxazine Compound Possessing a Cyclic Siloxane Core

High-Thermal Stable Epoxy Resin through Blending Nanoarchitectonics with Double-Decker-Shaped Polyhedral Silsesquioxane-Functionalized Benzoxazine Derivatives

Cross-Linking Behavior and Effect on Dielectric Characteristics of Benzocyclobutene-Based Polycarbosiloxanes

Synthesis and characterization of cardo-tetrafunctional hydrophobic polybenzoxazine composites for low-k application

Synthesis of eugenol-functionalized polyhedral oligomer silsesquioxane for low-k bismaleimide resin combined with excellent mechanical and thermal properties as well as its composite reinforced by silicon fiber

Low Dielectric Post-Cured Benzocyclobutene-Functionalized Fluorine-Containing Polyimide Material

Benzocyclobutene Resin With M-Carborane Cages And A Siloxane Backbone: A Novel Thermosetting Material With High Thermal Stability And Shapememory Property

A Fluorinated Thermocrosslinkable Organosiloxane: A New Low-k Material at High Frequency with Low Water Uptake.