Abstract:The development of microelectronics requires high performance interlevel dielectric materials with an extremely low dielectric constant and loss factor. Benzocyclobutene (BCB)-based materials have attracted significant attention because of their low-dielectric constant, low loss factor, and excellent high-temperature performance. The Dow chemical company has developed a series of BCB photoresists for interlevel dielectrics based on 1,3-bis[2-(1,2-dihyd-benzocyclobutene-4-yl) vinyl]-1,1,3,3-tetramethyldisiloxane (DVS-BCB). However, the introduction of a BCB group to prepare BCB resins requires expensive noble metal catalysts such as Pd salts for the Heck reaction or Suzuki reaction. Herein, a simple but novel synthetic route for the hydrolysis and condensation of BCB-functionalized chlorosilane (BCS) to obtain 1,3-bis(1,2-dihydro-benzocyclobutene-4-yl)-1,3-dimethyl-1,3-divinyldisiloxane (DBDVS) was developed. Similarly, BCB-functionalized chlorosilane as the BCB precursor can also react with silanols or alcohols such as 1,3-adamantanediol to afford 1,3-bis[(1,2dihydro-benzocyclobutene-4-yl) methylvinylsilyloxy]adamantane (AdaDBDVS), which provides a method for the BCB functionalization of hydroxyl-containing organic or inorganic surfaces. The cured DBDVS and AdaDBDVS exhibit high glass transition temperatures above 380 degrees C and good thermal stability (T-5% > 440 degrees C). Moreover, the crosslinking density of the cured DBDVS and AdaDBDVS is higher than that of the cured DVS-BCB. Thus, the cured DBDVS and AdaDBDVS exhibit better thermal mechanical properties such as higher modulus and higher glass transition temperature. In addition, the cured DBDVS exhibits a low CTE of 47.8 ppm per degrees C from 30 to 275 degrees C as well as an extremely low dissipation factor of 0.00045 at 1 MHz, which is lower than that of cured DVS-BCB.

Multi-benzocyclobutene Functionalized Siloxane Monomers Prepared by Piers-Rubinsztajn Reaction for Low-K Materials

Multibenzocyclobutene Functionalized Silane for Low-k Polyarylsilane Thermosets with Low Coefficient of Thermal Expansion and High Thermostability

Synthesis, Curing, and Thermal Stability of Low-Temperature-Cured Benzoxazine Resins Based on Natural Renewable Resources

Benzocyclobutene-functionalized Hyperbranched Polysiloxane for Low-K Materials with Good Thermostability

Novel Full Bio-Based Phloroglucinol Benzoxazine Resin: Synthesis, Curing Reaction and Thermal Stability

Double-decker Silsesquioxane-Doped Benzocyclobutene Functionalized Siloxane Polymer for Low K Materials

Synthesis, Properties of Novel Benzocyclobutene-Functionalized Siloxane Thermosets

Ring-Opening Copolymerization of Mixed Cyclic Monomers: A Facile, Versatile and Structure-Controllable Approach to Preparing Poly(methylphenylsiloxane) with Enhanced Thermal Stability

Synthesis, Thermal and Mechanical Properties of Benzocyclobutene-Functionalized Siloxane Thermosets with Different Geometric Structures

Benzocyclobutene organosiloxane resins prepared by alcoholysis of BCB functionalized chlorosilane for highly crosslinked low-k thermosets

Piers-Rubinsztajn reaction for BCB functionalized silphenylene/silbiphenylene siloxane oligomers to highly crosslinked low-k thermosets

Study of benzocyclobutene-functionalized siloxane thermoset with a cyclic structure

Low dielectric silsesquioxane-modified benzocyclobutene composites

Thermally Stable, Flame Retardant, Low‐dielectric Constants, and Flexible Thermosetting Resins Based on a Tetra‐functional Benzoxazine Compound Possessing a Cyclic Siloxane Core

Synthesis and characterization of cardo-tetrafunctional hydrophobic polybenzoxazine composites for low-k application

Synthesis and Properties of Highly Cross-Linked Thermosetting Resins of Benzocyclobutene-Functionalized Benzoxazine

Intrinsic low dielectric thermally crosslinked fluorinated polystyrene siloxanes at high frequency with good thermostability and optical properties

High Performance Thermosets from a Curable Diels–Alder Polymer Possessing Benzoxazine Groups in the Main Chain

Thermosetting benzoxazoles with endo-alkynyl groups: excellent thermal stability and low dielectric loss

Highly Cross-Linked Thermosetting Benzocyclobutene-Modified Bis-Benzoxazine Resins from 4-Hydroxybenzocyclobutene

Hydrolysis and condensation of a benzocyclobutene-functionalized precursor for the synthesis of high performance low-K polymers (vol 7, pg 14406, 2017)