Data Transfer Performance Analysis and Enhancement of Critical 3D Interconnects in a 3D SiP Based on Communication Channel Modeling Methodology
Min Miao,Zhensong Li,Xiaoyang Duan,Tianfang Chen,Xiaole Cui,Yufeng Jin,Huan Liu,Xin Sun
DOI: https://doi.org/10.1109/ectc.2017.85
2017-01-01
Abstract:Electromagnetic (EM) and circuit modeling are the prevailing practices for the anticipation and extraction of data transfer performances of 3D interconnects in a system-in-package (SiP). In comparison, this paper proposes a more abstract and cost-efficient evaluation method and an enhancement method thereof from the perspective of network information theory and communication channel modeling. Firstly, as the basis of the modeling, effects of non-idealities along data path and interferences are investigated by EM and circuit modeling and simulations, adopting typical 3D data links and their neighboring data lines as examples. Then, a channel model covering the data link of interest, based on network information theory, is established to anticipate its bit error rate (BER) as a key performance index up to a bit rate of 10Gbps, which is demonstrated to be intuitive and time-efficient. Eventually, a performance enhancement measure is proposed utilizing channel coding. The effectiveness and overhead of 2 codes with error correction capabilities are evaluated against un-coded scenario, realizing an BER enhancement from 10exp(-1) to 10exp(-5). In comparison, most conventional measures are more physical ones like shielding and complex error-proof transceivers configurations, which are often prohibitive in SiP scenario due to cost or overhead reasons. Thus, the method proposed may not only be a cost-efficient supplement to existing design methodologies but as more intuitive and insightful one on a higher level of design.