Design and analysis of thermal protection and load-bearing integrated structure of the telescopic wing
Hong Xiao,Hongwei Guo,Chunfeng Li,Dongdong Xie,Chunlei Xie,Rongqiang Liu
DOI: https://doi.org/10.1177/16878132231193865
IF: 2.1
2023-09-21
Advances in Mechanical Engineering
Abstract:Advances in Mechanical Engineering, Volume 15, Issue 9, September 2023. A novel three-layer integrated structure was designed to meet the thermal-insulation and load-bearing requirements of high-speed telescopic wing aircraft. The structure consists of heat shield layer, load-bearing skeleton, and pyramid lattice structure filled with aerogel to achieve the insulation function. Sensitivity analysis of the design parameters and optimal design of the integrated structure was carried out, and the structure was optimized by using response surface method. Compared to the initial structure, the optimized structure has an equivalent thermal conductivity of 0.0276, reduced by 40%, and a relative density of [math], reduced by 3.7%. And it has a thermal conductivity that is over 20% lower than that of ceramic insulating tiles. Then, the integrated structure was regarded as a homogeneous plate, and the equivalent mechanical and thermal parameters were determined and verified by simulation and experimental results. The equivalence error was controlled within 10%. Finally, a simulation model of the telescopic wing was established. The result shows that the maximum deformation under 20 kPa surface pressure is 3.96 mm. The temperature resistance of the structure surface is up to 1500°C, and the wing internal temperature is controlled within 200°C after 1200 s of thermal loading. The results verified that the integrated structure meets the requirement of a high-speed telescopic wing.
engineering, mechanical,thermodynamics