Mechanism of Seebeck Coefficient Variation at the Output of NiCr/NiSi Thin Film Thermocouple with Different Wires

Zhihui Liu,Tengda Guo,Yongjun Cheng,Bi Wang,Kai Shen,Kai Hu,Jiankang Zhou,Chuanbing Zhang,Zixi Wang,Wanyu Ding
DOI: https://doi.org/10.1088/1742-6596/2724/1/012001
2024-01-01
Journal of Physics Conference Series
Abstract:Abstract In this paper, by using magnetron sputtering to prepare NiCr/NiSi thin film thermocouples, the static calibration method is used for NiCr/NiSi thermocouples with rapid temperature calibration experiments. Different temperature calibration curves are obtained. The Seebeck coefficient of NiCr/NiSi thin film thermocouples connected to NiCr/NiSi wires is significantly higher (41.39 μV/°C) than that of NiCr/NiSi wires (0 μV/°C). The Seebeck coefficient (41.39 μV/°C) of the NiCr/NiSi thin-film thermocouple connected to copper wire is significantly higher than that of the thermocouple connected to copper wire (0 μV/°C). The problem of the Seebeck coefficient of the K-type thermocouple is analyzed by experimental data, which provides the relevant parameter basis for the use of the K-type thermocouple. The method has the advantages of simple equipment, convenient operation, accurate and reliable data, and provides a basis for the sensor to measure the temperature measurement.
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