Heterogeneous Diamond–tic Composites with High Fracture Toughness and Electrical Conductivity

Liang Zhou,Yuanyuan Li,Zili Kou,Linpeng Zheng,Qian Li,Guolong Ma,Youjun Zhang,Duanwei He
DOI: https://doi.org/10.1016/j.jeurceramsoc.2024.02.042
IF: 5.7
2024-01-01
Journal of the European Ceramic Society
Abstract:The concurrent enhancement of toughness, electrical conductivity, and thermal stability in polycrystalline diamond composites represents a formidable challenge. Here, a novel diamond-TiC composites (referred to as DTC) with high fracture toughness and conductivity were synthesized through a high-temperature and high-pressure reaction sintering process utilizing two precursors: diamond mixtures containing TiH2 and Ti-coated diamonds. On the one hand, the inherent bonding and encasing of TiC onto the diamond matrix form a heterogeneous structure, providing high strength and excellent fracture toughness up to 11.6MPa·m1/2. On the other hand, the established oxygen barrier and current pathway offer a thermal stability of 765 °C and high conductivity up to 837S·m-1. Remarkably, this rare combination of mechanical, electrical, and thermal properties has been realized within a single material under relatively moderate sintering conditions, thus positioning diamond-TiC composites as a promising ceramic for electrical applications in high-stress environments.
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