Numerical Simulation of Cavity-Filling Procedures for Micro-Pin-fin Array Thixoforming with Semi-Solid A356 Aluminium Alloy

Yong He
2012-01-01
The Chinese Journal of Nonferrous Metals
Abstract:To improve the cavity-filling performance of micro-pin-fin arrays,the flow characteristics and filling cavity behaviors of semi-solid A356 aluminium alloy during the micro-pin-fin array thixoforming were numerically investigated based on Deform 2D software.In the finite element analysis,micro-pin-fins were simplified as two-dimensional grooves with a constant depth,various widths and various locations.The influences of the process parameters,such as billet temperature,punch velocity and die temperature,and the punch structure parameters,such as groove aspect ratio,die duty ratio and groove location,on the cavity-filling performance of micro-pin-fin arrays were analyzed.The simulation results show that the liquid fraction of billets should be 40% 50% during thixoforming.With the decrease of the punch velocity,the radial cavity-filling of the edge micro-pin-fins increases.The increase of the die temperature can improve the uniformity of the billet temperature,leading to the lessening of micro-pin-fin bending or folding.The decrease of the groove aspect ratio results in a better cavity-filling.The radial cavity-filling of micro-pin-fins improves with the die duty ratio increasing,and becomes increasingly non-uniform with the distance between the micro-pin-fin and the billet axis increasing.
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