Ferroelectric Hafnium Oxide Films for In‐Memory Computing Applications
Zhenhai Li,Tianyu Wang,Jiajie Yu,Jialin Meng,Yongkai Liu,Hao Zhu,Qingqing Sun,David Wei Zhang,Lin Chen
DOI: https://doi.org/10.1002/aelm.202200951
IF: 6.2
2022-10-12
Advanced Electronic Materials
Abstract:Traditional von Neumann architecture is facing severe challenges due to separated physical structure of memory, which inspires the development of in‐memory computing electronics. Intriguingly, HfO2 is widely studied in the semiconductor field, showing great potential in constructing emerging electronics. Here, this work reviews the progress of HfO2 from materials to devices, including crystal structure, first‐principles calculation, and neuromorphic computing application. Traditional von Neumann architecture is facing severe challenges due to separated physical structure of memory and processing units, which inspires the development of in‐memory computing electronics. Intriguingly, as a kind of complementary metal‐oxide‐semiconducor compatible ferroelectric material, HfO2 is widely studied based on first‐principles calculation in the semiconductor field, showing great potential in constructing emerging electronics. Different structures including ferroelectric diode, ferroelectric field effect transistor, and ferroelectric tunnel junctions based on HfO2 are proposed for in‐memory computing application. Here, this work reviews the progress of HfO2 from materials to devices, including crystal structure, fatigue mechanism, first‐principles calculation, and neuromorphic computing application of HfO2‐based device. This work can provide a reference for the HfO2 ferroelectric device development for next‐generation in‐memory computing applications.
materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology