The Application of Traveling Probe Test Technology and Analysis of the Test Result

Tao Yao

2003-01-01

Abstract:The software applied in testing traveling Probe of Printed Circuit Board (PCB) as well as how to deal with the troubles in testing are discussed in the paper, the cause of closed and short circuit are analysed to ensure the quality of PCB products.

What problem does this paper attempt to address?

Design and implementation of a PCB testing system

李江波,潘雪增,平玲娣

DOI: https://doi.org/10.3785/j.issn.1008-973X.2001.06.006

2001-01-01

Abstract:The product test of PCB (printed circuit board), which checks the open circuit, short circuit, line cauterization and so on, is very important. It ensures the product quality and affects the cost of the PCB. A PCB test system integrates the testing point generation, testing-point linking and blueprint generation into one system. This paper deals with the design and implementation of a PCB testing system, especially the key algorithms in the implementation of the automatic testing point linking and the optimization of sequence strings' location. The algorithm of testing point linking cab improve the product quality and speedup the testing point linking process. The optimization algorithm of sequence strings' location can search the interspace of a linking graph automatically.
The Algorithm and Implementation of a Universal PCB Testing System

LI Jiang-Bo,PAN Xue-zeng,PING Ling-di

DOI: https://doi.org/10.3969/j.issn.1006-5911.2001.06.013

2001-01-01

Computer Integrated Manufacturing Systems

Abstract:The testing of a PCB (Printed Circuit Board)is very important to produce PCB. It affects the qulity and the cost of PCB. This paper mainly discusses the designing and implementation of PCB testing system, especially the key algorithms in the implementation of netlist generation and testing point auto generation module.
A Method Of Printed Circuit Board Failure Diagnosis Based On Infrared Image Processing

Yifan Lv,Yuehai Wang,Wenle Bai

2010-01-01

Abstract:For the fault diagnosis problem of complex printed circuit board whose working principle is unknown, a general fault diagnosis algorithm based on infrared image processing is presented. By introducing the concept "generalized distance" to compare infrared images in different working conditions and locate the fault area on the printed circuit board rapidly. The algorithm is simple, real-time and generalized. The result of the experiment shows the validity of this algorithm.
An Automatic Test System for a Spaceborne Chip of a Temperature-Sensing Controller

LIU Tong,CHEN Hua,QIU Jinpeng,WANG Zhiyu,LIU Xiaomin,WANG Liping,YU Faxin

DOI: https://doi.org/10.3969/j.issn.1004-1699.2016.09.026

2016-01-01

Abstract:In order to evaluate the electrical specification,temperature sensing and single event tolerance of space?borne phased-array T/R modules,an automatic test system based on PXI bus is designed and developed. By using this test system,the evaluation of a self-developed integrated controller with temperature sensor,which is embedded in a spaceborne X-band T/R module,is performed in this paper. By using high-speed digital I/O technology,the test speed of the present test system for electrical characteristics is improved. The ability of automatic temperature test with high-precision enables the accurate performance assessment of temperature sensing. And with the ability of au?tomatic data processing,the test system can realize the comparison between the measured electrical properties and the design specifications,the error analyzation between test data and calibration temperature and the variation esti?mation before and after single event effects. Finally,power distribution,temperature sensing and single event toler?ance of the chip are tested and analyzed. The results show that the chip can be well performed in the space environ?ment with rapidly changing temperature and strong radiations. At the same time,the test system has the advantages of simple operation,well portability,high speed of testing and high precision.
Efficient Analysis of Radiated Immunity of Printed Circuit Boards Using SPICE

Huapeng Zhao,Xianke Gao,Binfang Wang,Erping Li,Eng Kee Chua

DOI: https://doi.org/10.1109/isemc.2012.6351768

2012-01-01

Abstract:This paper proposes an efficient method for simulating the radiated immunity of printed circuit board (PCB) with arbitrarily oriented traces. Existing methods usually deal with plane wave excited PCB with simple configuration, for which a SPICE model can be analytically derived. Nevertheless, it is difficult to analytically develop a SPICE model for a PCB whose traces are arbitrarily oriented. In this work, traces of a PCB are divided into small segments. SPICE model of the PCB is obtained by connecting equivalent circuits of all segments. Meanwhile, the incident field is converted to distributed current and voltage sources in the SPICE model. Radiated immunity of the PCB is then analyzed using SPICE. Since it is challenging to analyze all traces of the PCB simultaneously, uncoupled traces are individually simulated. Numerical examples are presented to illustrate the advantages of the proposed method. It is shown that the proposed method is about 17 times faster than a full wave analysis method.
Boundary-scan test research and application for testing and diagnosis of printed circuit board with DSP

Wang Qining,Li Yonghong

DOI: https://doi.org/10.3969/j.issn.1000-8519.2011.04.015

2011-01-01

Abstract:For the testing and diagnosis of printed circuit board with DSP chips,a method integrating boundary scan and traditional vector inputting technique is introduced in this paper.The result of tests to such device indicate that faults can be effectively detected and isolated to the smallest unit that could be tested using this method.It describes the testing and diagnosis programs、hardware design scheme、testing script development and so on.The test coverage and positioning precision of testing have been greatly improved and this method has great practical application value.
Designs of Eddy Current Sensor Probes Based on Multilayer Printed Circuit Board Technology

Zhang Kai,Dai Xing-jian,Zhang Xiao-zhang

DOI: https://doi.org/10.4028/www.scientific.net/amm.190-191.801

2012-01-01

Applied Mechanics and Materials

Abstract:Probe characteristics are important for eddy current displacement sensors. Probes made by multilayer printed circuit board (PCB) are good at maintaining quality consistency and their axial length was short. As design principles for wired probes were not suitable for PCB probes, an analysis and design method for them was developed. In this paper, PCB probe characteristics were first analyzed with 3D eddy current field FEM software. The process was time-consuming. To increase analysis efficiency, a simplified 2D axial symmetry model was used to replace the 3D model. The analysis results were compared and their difference was small. The probe resister and inductance were compared with measurement result of a test PCB probe and they agreed well. Based on 2D model, a series of analysis was performed and basic design principles for PCB probes were obtained. Based on the principles, a new PCB probe with better performance was designed.
Feasibility Study of the Application of Voltage Contrast to Printed Circuit Board

CM Tan,ZH Gan,TC Chai

DOI: https://doi.org/10.1016/j.microrel.2005.04.014

2006-01-01

Abstract:Voltage contrast (VC) has been a powerful tool for the failure analysis of integrated circuits and multichip module. As the packing density of printed circuit board (PCB) is increasing, conventional failure analysis methods to detect open or short circuit in PCBs are no longer adequate, and voltage contrast method could be a method for this purpose. However, unlike the cases of integrated circuits and multichip module, there are many areas in PCB that will produce serious charging effect when examine under the scanning electron microscope. One of the areas is the presence of solder mask on PCB.This work examines the feasibility of using voltage contrast for PCB failure analysis. Specially designed PCB is used for experimentation, and it is found that positive bias on one track and zero bias on another copper track provide a better image contrast as compared to negative and zero biases on the tracks. Also, the variation of the image contrast with different spacing between inter copper tracks has studied. It is found that the variation depends on the presence of solder mask and its location. The variation can be very different for negative bias case as compared to the positive bias case.Finite element analysis is also performed to explain the experimental observations. All the observations can be well explained by the charging effect of the solder masks. The charging effect of solder mask is indeed very significant in affecting the image contrast, and it could reduce the contrast to almost zero in some cases. (c) 2005 Elsevier Ltd. All rights reserved.
Investigation of Multilayer Print Circuit Board Probe with Temperature Compensation for Ultra-Wideband Near-Field Measurement

Tao Song,Panpan Zuo,Yan Li,Mengjun Wang,Zhongqiu Hua,Hongxing Zheng,Er-Ping Li

DOI: https://doi.org/10.1109/temc.2019.2914735

IF: 2.036

2020-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:A novel ultra-wide band wireless probe applied to near-field electromagnetic measurement is presented in this paper, in which the probe is built on an FR-4 substrate with three layers. This paper presents both simulation and measurement study of the probe performance affected by various factors including the vias influence and terminal soldering. A temperature compensation circuit is designed to deal with the influence of temperature variation of the printed circuit board substrate. To assess the effectiveness of the proposed probe, the return loss, gain, and radiation pattern are simulated and experimentally tested. Both simulation and measurement demonstrate that the probe working frequency ranges from 3.1 to 10.6 GHz and the gain is greater than -50 dBm. Moreover, the tested results show that the probe has good stability in terms of temperature, and that it is suitable for the electromagnetic interference (EMI) near-field measurement.
An improved method for test chip design

PAN Wei-wei,ZHANG Bo,ZHENG Yong-jun,SHI Zheng,YAN Xiao-lang

2013-01-01

Abstract:The rapid development of IC manufacturing technology poses huge challenges to localize an electrical defect to a specific area on the IC.Either traditional or existing addressable design methods of test chip fail to fulfill the current requirements for fast and accurate defect localization.In this paper,we present an improved method for addressable test chip design.For electrical testing of test chip,four-terminal connection of each test structure and single NMOS transistor as switch are used to improve measurement accuracy,peripheral circuits design simplicity as well as area efficiency.For defect localization,only a small amount of pads are added and used together with switches to localize physical faults.This method is used in a 110nm CMOS technology and verified by the silicon results,which shows several real defects(metal open,etc) are localized to help determine the physical root causes and realize a rapid yield improvement.
Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation Technique

EP Li,WL Yuan,J Yi,LW Li,MI Montrose

DOI: https://doi.org/10.1109/isemc.2002.1032498

2003-01-01

Abstract:With increasing demand for higher operating frequencies, printed circuit board (PCB) designers are faced with numerous obstacles during the design cycle. The 20-H rule is one layout technique that is recommended to minimize radiated fields propagating from the edges of a PCB. These fields, either magnetic or electric, may corrupt adjacent cable assemblies, sheet metal enclosures and aperture openings. The magnitude of this design rule is investigated herein using the numerical electromagnetic simulation method, finite difference time domain (FDTD). In addition, an analysis on whether benefits exist from use of the 20-H rule is examined. The significance to the field of EMC lies in presenting, for the first time, an exhaustive analysis that took over one year to achieve using various configurations and frequencies. A rigorous analysis indicates that benefits do occur from use of the 20-H rule, but only when implemented in certain applications.
Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source Location

MI Montrose,HF Jin,EP Li

DOI: https://doi.org/10.1109/isemc.2004.1349995

2004-01-01

Abstract:With increasing demand for higher operating frequencies, designers are faced with numerous obstacles during the design and layout of printed circuit boards (PCBs). One area of concern that a designer may not think about, or recognize during the analysis stage, is the effects of RF wave propagation between the power and return planes caused by digital circuits switching logic states while consuming a large amount of inrush surge current. This is becoming an important design issue that should be considered prior to final PCB layout. The placement of components on a PCB and their physical distance to the edge of the assembly is the area of concern addressed, along with RF emissions that may propagate from the edge of the PCB causing potentially harmful effects under specific operating conditions and configurations.
A path planning algorithm for PCB surface quality automatic inspection

Zheng Xiao,Zhenan Wang,Deng Liu,Hui Wang

DOI: https://doi.org/10.1007/s10845-021-01766-3

IF: 8.3

2021-04-10

Journal of Intelligent Manufacturing

Abstract:The surface quality inspection of industrial printed circuit board (PCB) is a vitally important link in its manufacturing process. To inspect surface defects of PCBs effectively, the automatic optical inspection (AOI) technology, in which the PCB image acquisition depends on the path planning method, is widely adopted by industry. It is regarded as a characteristic travelling salesman problem (TSP), which includes component clustering, location adjustment and algorithm adaptation optimization. In this paper, by improving the ant colony algorithm (ACA) algorithm, we devise a PCB image acquisition path planning model and the corresponding solving algorithms. Because the ACA encounters difficulty escaping from the local optimal solution, an improved ACA with a negative feedback mechanism is proposed that is able to obtain a better tour path with a higher probability. Aiming at the uncertainty of the local location of image acquisition windows, location adjustment methods are introduced to further shorten the path length and improve the image acquisition efficiency. Finally, via simulation experiments, the proposed global negative feedback ACA (GNF-ACA) can shorten the average length of the tour path by 1.7% without changing the time complexity. The three methods of location adjustment can further shorten the length of the tour path by 5.6%, 13.1% and 13.7%.

engineering, manufacturing,computer science, artificial intelligence
Printed circuit board and printed circuit board assembly methods for testing and visual inspection: a review

Nikolay Petkov,Malinka Ivanova

DOI: https://doi.org/10.11591/eei.v13i4.7601

2024-08-01

Bulletin of Electrical Engineering and Informatics

Abstract:Testing and visual inspection of printed circuit boards (PCBs) and printed circuit board assemblies (PCBAs) are important procedures in the manufacturing process of electronic modules and devices related to locating and identifying possible defects and failures. Earlier defects detection leads to decreasing expenses, time and used resources to produce high quality electronics. In this paper an exploration and analysis about the current research regarding methods for PCB and PCBA testing, techniques for defects detection and vusial inspection is performed. The impact of machine and deep learning for testing and visual inspection procedures is also investigated. The used methodology comprises bibliometric approach and content analysis of papers, indexed in scientific database Scopus, considering the queries: “PCB and testing” and “PCB and testing”, “printed circuit board assembly and testing” and “PCBA and testing”, “PCB defect detection” and “PCBA defect detection”, “PCB and visual inspection”, and “PCBA and visual inspection”. The findings are presented in the form of a framework, which summarizes the contemporary landscape of methods for PCBs and PCBAs testing and visual inspection.
Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Er-Ping Li,Xing-Chang Wei,Andreas C. Cangellaris,En-Xiao Liu,Yao-Jiang Zhang,Marcello D'Amore,Joungho Kim,Toshio Sudo

DOI: https://doi.org/10.1109/temc.2010.2048755

IF: 2.036

2010-01-01

IEEE Transactions on Electromagnetic Compatibility

Abstract:The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of effi...
Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process

Yu Guo,Minghe Liu,Mingang Yin,Yutao Yan

DOI: https://doi.org/10.3390/math10173055

IF: 2.4

2022-08-25

Mathematics

Abstract:As a vital component of electronic products, the quality of the printed circuit board (PCB) assembly directly affects the applications and service life. During the reflow soldering process, the PCB assembly may suffer excessive warpage. Therefore, in order to avoid such a failure, this paper conducts the finite element simulation of the PCB assembly temperature change and the deformation process according to a theoretical model for heat transfer and then explores the causes of warpage and predicts the percentage of warpage that occurs during the reflow soldering. A reliability sensitivity analysis is creatively applied in the PCB assembly warpage study in order to uncover the quantitative influence of multiple factors with random errors on warpage. Moreover, the reliability calculation provides a theoretical basis for the allowable error range of geometric dimensions, material properties and process parameters of the PCB assembly. This research has a remarkable significance and is valuable to engineering in promoting quality and reliability, and increasing the yield of PCB assembly in mass production.

mathematics
A Novel PCB Defect Detection Method Based on Digital Image Processing

Guangxin Zhang,Yu Cao

DOI: https://doi.org/10.1088/1742-6596/2562/1/012030

2023-08-18

Journal of Physics: Conference Series

Abstract:Printed circuit board (PCB) has a wide range of applications, and its automated quality inspection is a vital part of economic production. The time overhead of the current PCB defect detection method will increase with the increase in the number of detection targets. To ensure the stability of detection performance, this paper proposes a novel PCB detection method based on color threshold segmentation. Experiments show that this method can effectively detect and analyse various information about solder pads and solder pastes, among which the detection accuracy rate of solder pads is 99.4%, the missed detection rate is 0.4%, and the detection accuracy rate of solder paste is 99.3%, The missed detection rate is 0.03%. At the same time, the method in this paper has better robustness and stability than other PCB defect detection methods, and can better meet the needs of industrial production.
Research on the Testing and Diagnosis System of Printed Circuit Board Based on Artificial Intelligent Algorithm

Wang Qi-ning,Li Yong-hong

2011-01-01

Abstract:For the problems of existing huge fault data,analyzing difficult and relying manual work much more in fault diagnosis of printing circuit board for traditional fault dictionary,the article introduces the artificial intelligent technologies such as wavelet analysis,information amalgamation,data mining and neural network into the fault diagnosis field of printed circuit board.The application scheme of these four technologies is researched in this field.The paper also designs and realizes an artificial intelligent fault diagnosis system of printed board with the integration of the above four technologies.The system uses the key characteristic of extracting fault data of wavelet analysis to identify all faults by data mining and neural network.
Automatic printed circuit board inspection: a comprehensible survey

Luis Augusto Libório Oliveira Fonseca,Yuzo Iano,Gabriel Gomes de Oliveira,Gabriel Caumo Vaz,Giulliano Paes Carnielli,Júlio César Pereira,Rangel Arthur,Iano, Yuzo,Oliveira, Gabriel Gomes de,Carnielli, Giulliano Paes

DOI: https://doi.org/10.1007/s44163-023-00081-5

2024-02-06

Discover Artificial Intelligence

Abstract:The printed circuit board (PCB) plays a critical role in any electronic product, and its manufacturing quality assurance is responsible for substantially impacting the final product's price. Hence, research and development (R&D) for better inspection methods have been an internationally growing subject. Regarding the multiple PCB inspection paradigms, the visual investigation of these boards represents the majority of modern techniques. Thus, the present survey collects the most impacting studies over the last 25 years, highlighting their operation strategies and how they evolved until recently, including introducing artificial intelligence (AI) approaches to increase their overall performance and lower operating costs. Furthermore, this work calls attention to the importance of public PCB datasets to contribute to developing such methods and provide benchmarking references. Finally, the most recent challenges in the field are described and discussed.
EMC Trouble Diagnosing Techniques in Power Electronic System Based on Near Field Probes

FENG Li-min,QIAN Zhao-ming

DOI: https://doi.org/10.3969/j.issn.1000-100x.2007.06.006

2007-01-01

Abstract:Based on the radiation model of the normal circuits in power electronic system,the manufacture method of the near field probes and the way to obtain the performance factor curve of the probes are presented in this paper.Thereafter,the EMC trouble diagnosing techniques and their application areas are introduced.The validity of the techniques based on near field probes is verified by the experimental results.

The Application of Traveling Probe Test Technology and Analysis of the Test Result

Design and implementation of a PCB testing system

The Algorithm and Implementation of a Universal PCB Testing System

A Method Of Printed Circuit Board Failure Diagnosis Based On Infrared Image Processing

An Automatic Test System for a Spaceborne Chip of a Temperature-Sensing Controller

Efficient Analysis of Radiated Immunity of Printed Circuit Boards Using SPICE

Boundary-scan test research and application for testing and diagnosis of printed circuit board with DSP

Designs of Eddy Current Sensor Probes Based on Multilayer Printed Circuit Board Technology

Feasibility Study of the Application of Voltage Contrast to Printed Circuit Board

Investigation of Multilayer Print Circuit Board Probe with Temperature Compensation for Ultra-Wideband Near-Field Measurement

An improved method for test chip design

Analysis on the Effectiveness of the 20-H Rule Using Numerical Simulation Technique

Analysis on the Effectiveness of High Speed Printed Circuit Board Edge Radiated Emissions Based on Stimulus Source Location

A path planning algorithm for PCB surface quality automatic inspection

Printed circuit board and printed circuit board assembly methods for testing and visual inspection: a review

Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects

Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process

A Novel PCB Defect Detection Method Based on Digital Image Processing

Research on the Testing and Diagnosis System of Printed Circuit Board Based on Artificial Intelligent Algorithm

Automatic printed circuit board inspection: a comprehensible survey

EMC Trouble Diagnosing Techniques in Power Electronic System Based on Near Field Probes