Low-thermal-budget synthesis of monolayer MoS2

Zongmeng Yang,Shibo Fang,Jing Lu
DOI: https://doi.org/10.1007/s40843-023-2718-6
2023-01-01
Science China Materials
Abstract:Two-dimensional(2D)materials,such as MoS2,have been considered as a competitive coordinate for future electronics due to their excellent electrostatics and high mobility[1-3].More-over,the potential integration of 2D materials with silicon cir-cuits can present increased density and multifunction in future heterogeneously integrated circuits[4,5].However,the high thermal-budget during MoS2 synthesis exceeds the temperature requirement of direct integration with Si in the back-end-of-line(BEOL)fabrication process[6-8].Temperatures above 400℃ will damage the dopant distribution in silicon,the gate dielectric layer,and the interconnect quality[6].Furthermore,achieving uniform and high-quality growth of 2D materials on wafers,especially those 2D materials with diameters of~200 mm or larger,is also challenging[9].
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