Abstract:In this study, combining the single point diamond turning (SPDT) and spark plasma sintering (SPS), we achieved high-strength diffusion bonding of copper at an ultra-low temperature of 202 degrees C (0.35 T m , T m : absolute temperature of the melting point). Additionally, the closure mechanism of interfacial microand nano-voids during the Cu-Cu SPS diffusion bonding is systematically revealed for the first time. For micro-voids, the pulsed current is found to induce additional diffusion flux and plastic deformation, thereby facilitating the void closure. Molecular dynamics (MD) simulation revealed that at the atomic scale, high-energy Cu atoms induced by the pulsed current can significantly promote the diffusion of low-energy atoms in their vicinity and accelerate the void closure. This study also proposes a novel "evaporation-deposition" nano-void closure mechanism for the previously unstudied nano-void closure process. The results show that the synergistic effect of the pulsed current and nanoscale surface roughness can significantly improve joint strength. At a low temperature of 405 degrees C (0.5 T m ), on combining the computerized numerical control (CNC) turning and SPS diffusion bonding, the joint strength can reach 212 MPa, while that for the joint obtained by traditional hot pressing diffusion bonding at the same temperature is only 47 MPa. We obtained an ultra-high joint strength of 271 MPa using the combined process of SPDT and SPS diffusion bonding at an ultra-low temperature of 202 degrees C (0.35 T m ), which is approximately 600 degrees C lower than the traditional diffusion bonding process temperature of 800 degrees C (0.79 T m ). To sum up, this study provides a novel method and theoretical support for realizing low-temperature high-strength diffusion bonding.(c) 2022 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology.

Interdiffusion Mechanism and Thermal Conductance at the Interfaces in Cu-to-Cu Bonds Achieved by Coating Nanolayers

Study on interface behavior of Be/CuCrZr alloy by diffusion bonding

Al-clad Cu Bond Wires for Power Electronics Packaging: Microstructure Evolution, Mechanical Performance, and Molecular Dynamics Simulation of Diffusion Behaviors

Enhanced Cu-Cu bonding for ultrahigh-density interconnection: Co passivation bonding with non-oxidation interfaces

Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper

Interfacial Characterization of Low-Temperature Cu-to-Cu Direct Bonding with Chemical Mechanical Planarized Nanotwinned Cu Films

Unraveling diffusion behavior in Cu-to-Cu direct bonding with metal passivation layers

Thermal instability of nanocrystalline Cu enables Cu-Cu direct bonding in interconnects at low temperature

Thermal interfacial coupling between electroplated copper and indium

Mechanism Of Low Temperature Cu-In Solid-Liquid Interdiffusion Bonding In 3d Package

Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget

Coexistent Improvement of Thermal and Mechanical Performance at Si/Cu Joint by Thickness-Controlled Sn-Ag Bond Layer

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Thermal-stable Void-Free Interface Morphology and Bonding Mechanism of Low-Temperature Cu-Cu Bonding Using Ag Nanostructure As Intermediate

Enhanced Copper Bonding Interfaces by Quenching to Form Wrinkled Surfaces

Interface Enhancing Strategy for Low-Temperature Bonding of Ag-based Nanoalloy

Enhancement of Low-Temperature Cu-Cu Bonding by Metal Alloy Passivation in Ambient Atmosphere

A Novel Low-temperature Co-Co Direct Bonding for Future 3D Interconnection

Interface Development in Cu-Based Structures Transient Liquid Phase (TLP) Bonded with Thin Al Foil Intermediate Layers

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Cu-Cu low-temperature diffusion bonding by spark plasma sintering: Void closure mechanism and mechanical properties