Rapid Manufacturing of Diamond/Cu Composites Prepared Via Ultrasonic Consolidation

Bo Wang,Hongtao Zhang,Yanlong Fan,Jiang Yu,Fan Yang,Peng He
DOI: https://doi.org/10.2139/ssrn.4150321
2022-01-01
SSRN Electronic Journal
Abstract:A rapid low-temperature solid-phase preparation method for diamond/copper composites based on an ultrasonic consolidation process is proposed. The surface modification of diamond particles is carried out by the molten salt method to form a Cr 7 C 3 layer for improving the bonding between the copper matrix. The thermal conductivity of Cr-coated diamond-copper composites is closely related to the integrity of the diamond carbide layer. In this study, the diamond particle diameter was fixed at 100 μm, and the metallization temperature was varied between 750–950 °C to tune the formation and integrity of the interfacial carbide layer. The evolution process of the chromium coating on the diamond surface and the interface configuration and bonding between the Cr-coated diamond and the copper matrix were studied by SEM, EDS, FIB and HRTEM. Finally, Cr-coating diamond-copper composites with a thermal conductivity of up to 421W/mK was prepared. Compared with the existing high temperature and high pressure method, the thermal conductivity obtained per unit volume of diamond was increased by more than one order of magnitude, and the temperature and pressure required for processing were reduced by more than 2/3 and 1/50. The study of this process can open up new avenues for low-temperature, low-pressure, free-design, and open fabrication of particle-reinforced metal matrix composites.
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