Abstract:Recent advanced packaging technologies such as 2.5D chiplet-package offer a modular approach to increasing yield over monolithic SoC designs. As 2.5D chiplet systems shed light on reducing product development times and costs, 3D chiplet systems can extend the benefits furthermore by offering more remarkable performance. As semiconductor technology continues, the significance of thermal management has arisen even for a monolithic chip. When it comes to 3D chiplet systems, thermal issue remains being one of the most critical obstacles to transitioning from 2.5D to 3D. Microfluidic cooling has been proved to be a promising cooling solution, yet the actual detailed thermal indications for making the direct transition under this cooling strategy are still missing. HotSpot 7.0 emerged as the latest pre-RTL thermal analysis framework that introduced a novel thermal management method using microfluidic cooling on the widely used pre-RTL power and thermal simulator. This paper presents evolution investigations from 2.5D to microfluidic-cooled 3D integration from the thermal management aspect using HotSpot 7.0. We studied a typical 2.5D chiplet as an example, and it has one processor chip in the center and four high bandwidth memory (HBM) chips on the sides. The thermal management method with microfluidics reduces the maximum temperature of 2.5D and 3D chiplet by 47.2°C and 63.83°C, respectively. In addition, as a high-performance system example, a hypothetical processor-processor integration is investigated. The simulation results show that the conventional air convection type is hard to maintain the chiplet temperature under the operating temperature range. Microfluidic cooling is advantageous in heat dissipation and heat spreading. The cooling capacity is dependent on the pump pressure. Multi-layer cooling is a promising cost-effective solution for the 3D chiplet system.

Thermal Evaluation for Monolithic 3D Integrated Circuits Based on Gate-all-Around Transistors

Monolithic Three‐dimensional Integration of Aligned Carbon Nanotube Transistors for High‐performance Integrated Circuits

System-Level Analysis of 3D ICs with Thermal TSVs

Thermal Management in Fine-Grained 3-D Integrated Circuits

A Full Chip Scale Numerical Simulation Method for Thermal Management of 3D IC

Integrated Manifold Microchannels and Near-Junction Cooling for Enhanced Thermal Management in 3D Heterogeneous Packaging Technology

Thermal Effects on Monolithic 3D Ferroelectric Transistors for Deep Neural Networks Performance

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic

Accelerating Device-Circuit Self-Heating Simulations with Dynamic Time Evolution for GAAFET

Thermal Performance Analysis of Carbon Materials Based TSV in Three Dimensional Integrated Circuits

Thermal Design, Analysis and Verification of Chip-Level MCM with Properties of Semiconductor Materials

Efficient Thermal Management Strategies for 3D-SiP Architectures

Self-Heating Effects of Vertical Gate-All-Around Transistors: Analysis and Modeling

Calculations of Temperature Distributions for Power MMICs in 3-D Packages

From 2.5D to 3D Chiplet Systems: Investigation of Thermal Implications with HotSpot 7.0

Monolithic-3D Integration with 2D Materials: Toward Ultimate Vertically-Scaled 3D-ICs

A layout-to-simulation approach for thermal design of IC

Physical Modeling And Simulation Of Thermal Heating In Vertical Integrated Circuits

Investigation On The Effect Of Multiple Parameters Towards Thermal Management In 3d Stacked Ics

Analytical Multistage Thermal Resistance Model for NSFET Self-heating Effects