Improving Interfacial Wettability, Physical, and Mechanical Properties of Ag/La 1− X Sr X CoO 3 Electrical Contact Materials by in Situ Cu-Doping

Xiao-hua Zheng,Da-shuai Wang,Tao Shen,Zi-yang Shao,Hui Yang,Fang-er Yang
DOI: https://doi.org/10.1007/s11665-023-08493-1
IF: 2.3
2024-01-01
Journal of Materials Engineering and Performance
Abstract:The influence of in-situ Cu-doping on interfacial wettability and the physical and mechanical properties of Ag/La1−xSrxCoO3 (LSCO) electrical contact materials were reported in this research. In this study, a series of Cu-doped Ag/LSCO materials were prepared by high-energy ball milling followed by hot extrusion and drawing. The results show that LSCO powder has both lamellar and granular morphologies, and Cu ions dissolve into the lattice of LSCO with a maximum content of 3.2
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