Self-aligned Patterning of Tantalum Oxide on Cu/SiO2 Through Redox-Coupled Inherently Selective Atomic Layer Deposition.

Yicheng Li,Zilian Qi,Yuxiao Lan,Kun Cao,Yanwei Wen,Jingming Zhang,Eryan Gu,Junzhou Long,Jin Yan,Bin Shan,Rong Chen
DOI: https://doi.org/10.1038/s41467-023-40249-2
IF: 16.6
2023-01-01
Nature Communications
Abstract:Atomic-scale precision alignment is a bottleneck in the fabrication of next-generation nanoelectronics. In this study, a redox-coupled inherently selective atomic layer deposition (ALD) is introduced to tackle this challenge. The ‘reduction-adsorption-oxidation’ ALD cycles are designed by adding an in-situ reduction step, effectively inhibiting nucleation on copper. As a result, tantalum oxide exhibits selective deposition on various oxides, with no observable growth on Cu. Furthermore, the self-aligned TaOx is successfully deposited on Cu/SiO2 nanopatterns, avoiding excessive mushroom growth at the edges or the emergence of undesired nucleation defects within the Cu region. The film thickness on SiO2 exceeds 5 nm with a selectivity of 100%, marking it as one of the highest reported to date. This method offers a streamlined and highly precise self-aligned manufacturing technique, which is advantageous for the future downscaling of integrated circuits. ‘Atomic-scale precision alignment is a bottleneck in the fabrication of next generation nanoelectronics. Here, the authors used redox-coupled inherently selective atomic layer deposition of tantalum oxide on Cu/SiO2 and achieved 100% selective deposition on SiO2 and no observable growth on copper.’
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