SoP Design on Liquid Crystal Polymer Substrate for 5 GHz RF Receiver Front-End Module

Yasar Amin,Hannu Tenhunen,Zheng Lirong,Xinzhong Duo

2005-01-01

Abstract:Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase per ...

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Chip Package Co-design of 5ghz RF Receiver Front-End Using Multichip Module Technology

Yasar Amin,Hannu Tenhunen,Li‐Rong Zheng,Xinzhong Duo,Saad Amin

2005-01-01

Abstract:The transceivers for future technology (third generation cellular, wireless LAN) need to be portable (compact), battery-powered and wireless. The present single-chip solutions for RF front-ends do not yield complete system integration. A system-on-a-package (SoP) approach can solve these problems. High quality components can be integrated in the package. This paper reports a fully integrated single-package RF prototype module for a 5 GHz WLAN receiver front-end, which is intended to demonstrate the concept of SoP integration. The approach that is illustrated here is implemented with a thin film multichip module (MCM-D) interconnect technology. This technology also allows the integration of high quality passive components. With these passives, low-loss filters can be implemented.
Design and implementation of a 5GHz RF receiver front-end in LCP based system-on-package module with embedded chip technology

xinzhong duo,lirong zheng,hannu tenhunen,ling chen,gang zou,jinking liu

DOI: https://doi.org/10.1109/EPEP.2003.1249998

2003-01-01

Abstract:In this paper, we present a receiver front-end for 5GHz wireless LAN in novel LCP (liquid crystal polymer) based system-on-package module. The module is based on embedded chip technologies for system-on-package, which eliminates the constraints of off-chip pad drive capability and hence improves electrical performance. Furthermore, the novel LCP material shows excellent RF and microwave performance. The quality factors of key passive components such as inductors integrated in LCP substrate with thin film technologies is as high as 60. The insertion loss of the bandpass filter is 3dB. The conversion gain of the receiver front-end is 20dB and occupies 8.7mm by 3.6mm area.
Design of efficient filter on liquid crystal polymer substrate for 5 GHz wireless LAN applications

Yasar Amin,Hannu Tenhunen,Habibullah Jamal,Li-Rong Zheng

2005-01-01

Abstract:Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents high-density multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on LCP substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.
A 0.5-8Ghz Reconfigurable CMOS RF Receiver Front-end for CR and DPA Applications

Hui Nie,Tiancheng Yu,Jiangbo Chen,Jiabing Liu,Dongdong Liu,Xiaopeng Yu,Qun Jane Gu,Zhiwei Xu

DOI: https://doi.org/10.1109/tcsii.2024.3423839

2024-01-01

IEEE Transactions on Circuits & Systems II Express Briefs

Abstract:This brief presents a 0.5-8 GHz CMOS RF receiver front-end (RxFE) tailored for cognitive radio (CR) and digital phased array (DPA) applications. The RxFE comprises a wideband mixer with noise suppression capability, along with a reconfigurable band-pass filter (BPF) designed to adapt to different intermediate frequencies (IFs) and signal bandwidths (SBWs). Additionally, the BPF functions as a programmable gain amplifier (PGA), enabling support for a large dynamic range with fine gain adjustment. The BPF offers a programmable center frequency (CF) range from 250 MHz to 450 MHz with a 5 MHz step, as well as support for tunable passbands from 60 MHz to 240 MHz with 5 MHz resolution. The RF RxFE provides a gain control range of 15-to-55 dB with a 0.5 dB gain step. Fabricated in a standard 55 nm CMOS process, the prototype occupies an area of 2.29 mm2 including pads, consuming 75.6mW power without an on-chip high-IF BPF and 226.8mW with it at 2.3GHz LO input. Measurement results indicate that the prototype achieves approximately 10 ns gain switching time and 350 ns frequency hopping time when driven by an external fast-switching local oscillation (LO) signal, attributed to its high IF architecture. The receiver demonstrates exceptional agility, meeting the stringent requirements of CR and DPA applications.
Chip-Package Codesign Of Receiver Front End Modules For Rf/Wireless Applications

yasar amin,hannu tenhunen,habibullah jamal,lirong zheng,xinzhong duo

DOI: https://doi.org/10.1109/WCACEM.2005.1469698

2005-01-01

Abstract:In this document, we have shown the advantages of SoP using MCM-D technology as a solution for producing integrated parts for use in RF systems offers many significant advantages over more traditional technologies. In particular the size reductions and performance improvements possible allow product developers to meet more closely the requirements of the market place. The realization of complete receiver front end has demonstrated clearly the potential of this technology to integrate complex RF functions into small, single modules. This technology is demonstrated as a high performance and low cost packaging technology and will be a competitive technology in future RF/wireless SoP application.
Progress on Liquid Crystal Polymer for High Frequency Applications

ZHOU Meisheng,ZHANG Wenlong,DING Dongyan,LI Ming

DOI: https://doi.org/10.3969/j.issn.1005-023x.2012.03.003

2012-01-01

Abstract:The characteristics of liquid crystal polymer(LCP) systematically are disussed.Meanwhile,three main producing methods are addressed and superiority is discussed compared with the other conventional packaging substrates.Finally,the recent research progress of LCP film in system-in-package as microwave and millimeter materials,which is regarded as future substrate and packaging material,is also reviewed.
Plasmonic‐Enhanced Polymer‐Stabilized Liquid Crystals Switching for Integrated Optical Attenuation

Jialing Jian,Ruizhe Liu,Yuting Ye,Jianghong Wu,Qingyan Deng,Maoliang Wei,Yiheng Tang,Renjie Tang,Boshu Sun,Hui Ma,Yilin Shi,Chuyu Zhong,Chunlei Sun,Hongtao Lin,Ming Li,Lan Li

DOI: https://doi.org/10.1002/adom.202400281

IF: 9

2024-01-01

Advanced Optical Materials

Abstract:Liquid crystals are widely used in photonics because of their profound electro-optic properties. However, the slow switching speeds (milliseconds) and the fluid nature of liquid crystals restrict their potential use in integrated photonics. In this work, polymer-stabilized liquid crystals are utilized as the functional material to improve the response time with a polymer network that helps pre-orientate the liquid crystal. Additionally, plasmonic slot structures are simultaneously employed to minimize the switch voltage by confining the optical field within the electrode spacing at subwavelength scales. Thanks to the large overlap of the optical and electric fields, the scattering states of the polymer-stabilized liquid crystal can be effectively manipulated to modulate the loss of the propagating wave, resulting in strong optical attenuation in the integrated photonic platform. Specifically, a plasmonic enhanced polymer-stabilized liquid crystal photonic device for operation at 1550 nm, which has a length of only 10 mu m and shows an extinction ratio of 0.38 dB mu m-1, with a power consumption of less than 6 mu W and a response time approximate to 20 mu s, resulting in a figure-of-merit of 0.012 mW. A scheme of on-chip integrated optical attenuators for plasmonic slot waveguide-enhanced electro-optical properties of polymer-stabilized liquid crystal film is proposed. This prototype reduces the response time and improves the modulation efficiency of the liquid crystal-based integrated photonic device, resulting in a compact and energy-efficient platform for on-chip optical modulation. image
High performance RF-microwave multilayer integrated components for wireless applications

Yasar Amin,Hannu Tenhunen,Habibullah Jamal,Li-Rong Zheng,Xinzhong Duo

2005-01-01

Abstract:Future high-performance wireless communication applications such as wireless local area networks (WLANs) around 5GHz require low power and high quality integrated transceiver solutions. The integration of RF front-end especially poses a great challenge to these applications as traditional system on chip (SOC) approach is quite inefficient. A system on package approach can address the problems in an optimum way. In this paper we present a comparison of different passive element fabrication choices. These passives are to be fabricated between different modules on an MCM-D substrate. Inductors and capacitors are compared on the bases of their Q-factors and SRF (self resonance frequency). RF receiver module for 5GHz wireless LAN applications is implemented using benzocyclobutene (BCB) as interlayer material.
Liquid Crystal Polymer: Potential Bio-Compatible Substrate for Antenna Application

V. Adhikar,B. Biswas,A. Karmakar

Abstract:This work describes the capability of Liquid Crystal Polymer (LCP) as an attractive choice for antenna usages targeting several bio-medical applications. One lower frequency application details about the development of a conformal, wideband, fractal implemented miniaturized antenna for wireless capsule endoscopy purpose over 2450 MHz Industrial, Scientific and Medical (ISM: 2400-2480 MHz) band. Whereas, another application outlines the developmental activity targeting high gain 100 GHz planar antenna array for medical imaging with appreciable resolution. Both of the works have been explained in detail with design, modelling and fabrication issues. Substrate has also been modelled for high-frequency application.

Engineering,Medicine,Materials Science
A Multi-functional Frequency Selective Polarization Converter Based on Substrate Integrated Waveguide Cavities

Yan Ren,Hai Lin,Rongxin Tang,Yanjie Wu,Rui Zhou,Jie Xiong

DOI: https://doi.org/10.1088/1361-6463/ac6992

2022-01-01

Abstract:In this paper, a multi-functional frequency selective polarization converter (FSPC) based on the substrate integrated waveguide cavities (SIWC) is presented. The proposed structure is based on a circular shape SIWC with orthogonal rectangular slots on the top/bottom layer of each unit cell. The neighboring SIWC are connected to each other by metalized vias which formed a shared diamond shape cavity. Two cross shape slots serve as additional input and output channel for the shared SIW cavity. The novel design introduces more functions to the device. When the device acts as a frequency selective surface, it provide two transmission window around 8.52 and 13 GHz. It can also realize cross-polarization conversion between TM and TE polarized waves from 15.87 to 17.01 GHz as well as narrowband polarization conversion around 10.33 GHz. The working mechanism of proposed design has been explained through the analysis of the surface current distribution. In order to verify the performance of the design, a prototype was manufactured and measured, the simulated and measured results are highly consistent with each other.
Design of hybrid structure for fast and deep surface plasmon polariton modulation.

Chenlei Pang,Hangwen Lu,Pengfei Xu,Haoliang Qian,Xiaowei Liu,Xu Liu,Haifeng Li,Qing Yang

DOI: https://doi.org/10.1364/OE.24.017069

IF: 3.8

2016-01-01

Optics Express

Abstract:The electric and optical performance of different surface plasmon polariton (SPP) electric modulation structures have been investigated by comparing the response speed and modulation figures of merit (FoM). To overcome the capacitance limitation and improve the response speed, we proposed a novel silver-graphene-dielectric-graphene-semiconductor vertical structure. Semiconductor nano-waveguide is introduced to help reduce ohmic loss in silver waveguide and reflect the leaked optical field back, enhancing the modulation depth. Through optimization, a device with estimated modulation FoM of more than 70% and hundreds of GHz response speed and 3 dB bandwidth is designed, which may bring great improvement to previous optical modulators. (C) 2016 Optical Society of America
Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications

tommi torikka,xinzhong duo,lirong zheng,esa tjukanoff,hannu tenhunen

DOI: https://doi.org/10.1109/ECTC.2004.1320343

2004-01-01

Abstract:In this paper, we present a chip-package co-design of a concurrent low noise amplifier (LNA) in novel liquid crystal polymer (LCP) based system-on-package module for multiband radio transceivers. The module consists of a wideband LNA covering frequency range 1 GHz - 13 GHz and a multiband pass filter. By designing an appropriate multi-band passive filter, the wideband LNA can be configurated flexibly as a multi-band LNA that works currently across any different band in the above frequency range. In this work the multiband LNA is designed for 5 GHz wireless LAN and 2.5 GHz Bluetooth standards. The module is implemented with embedded chip technologies for system-on-package, which eliminates the constraints of off-chip pad drive capability and hence improves electrical performance. The design is implemented on novel liquid crystal polymer (LCP) substrate. The quality factors of key passive components such as inductors integrated on LCP substrate with thin film technologies is better than 30. The insertion loss of the band pass filter is around 3 dB and return loss is lower than -18 dB. The gain of the wideband LNA is better than 10 dB at frequency range from I GHz to 13 GHz. and its gain is better than 10 dB. The gain of the multi-band LNA is 8.5 dB and noise figure is 5.2 dB on the selected channels.
Menis Siob Design For Integrated Transceiver Application

Yr Yang,Ym Cai,Yl Wang,Jy Yang,Ym Wu,L Luo,Xq Sun

DOI: https://doi.org/10.1117/12.519922

2004-01-01

Abstract:A novel self-aligning SIOB (SIlicon Optical Bench) for fully passive alignment of optical components is proposed for integrated transceiver modules. The coupling efficiency from laser diode directly to fiber is about 8%(1) in theory because of severe mode mismatch and large NA difference. To pursue high coupling efficiency, a ball lens is added between laser diode and fiber. The calculations and simulations are done to optimize the optical system according to optical component specifications. The coupling efficiency is up to 45%. We designed the layout and fabricated the SIOB in (100) silicon wafer to obtain the demanding cavities by MEMS technology.
A 2.5D Integrated L Band Receiver Based on High Resistivity Si Interposer

Shenglin Ma,Yuan Chai,Jun Yan,Han Cai,Liulin Hu,Shuwei He,Wei Wang,Jing Chen,Yufeng Jin

DOI: https://doi.org/10.1109/cicta.2018.8705960

2018-01-01

Abstract:Transmitter/Receiver (T/R) is a basic part for the RF front-end module, whose miniaturization and integration are very important for the improvement in integration density, function complexity and performance. The state of art of high performance T/R is mainly realized with heterogeneous integration based on advance ceramics such as High Temperature Co-fired Ceramic (HTCC) and Low Temperature Co-fired Ceramic (LTCC). This scheme is helpful to fully utilize the excellent performance of various devices based on substrate such as GaAs, InP, and GaN substrate, however, it confronts shortcomings in re-wiring lines of low precision, shrinkage mismatch during co-firing process, low thermal conductivity. TSV interposer having its Re-wiring line realized with IC back-end metallization process, MEMS process, etc., and using Through-Silicon-Via (TSV) to achieve vertical interconnections between rewiring lines on both surface, is able to provide a good match in rewiring line with RF microelectronic chips, factoring in improvement in RF loss properties with high-resistivity Si as substrate instead of normal low resistivity Si, therefore is acknowledged to be a competitive package substrate for building a highly integrated RF system. In this context, we present a 2.5D integrated L-band Receiver based on TSV interposer, the test results prove the feasibility of 2.5D RF integration enabled by high-resistivity Si interposer.
A Novel 3-D Frequency Selective Structure for Radiation Leakage Suppression in Sub-6G Highly Integrated Package

Yun-Long Wu,Da Li,Yu-Di Fan,Han-Zhi Ma,Er-Ping Li

DOI: https://doi.org/10.1109/edaps56906.2022.9995136

2022-01-01

Abstract:This paper presents a novel three-dimensional frequency selective surface (3-D FSS) dedicated to highly integrated package in Sub-6G communication applications. The structure operates between 3.3 GHz and 3.8 GHz with two stopbands on each side. A stable response under the incident angles up to 50° is shown through an electromagnetic simulator analysis. The in-band insertion loss is less than 0.65 dB and the out-of-band insertion loss is more than 10 dB for both TE and TM polarizations under the incident angle up to 50°. Moreover, this novel structure is insensitive to all polarization and has a unit cell size of 0.07λ. All these results indicate that the proposed FSS is a good candidate for radiation leakage suppression in Sub-6G highly integrated package.
Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Zepeng Zhou,Wenqing Li,Jun Qian,Weihong Liu,Yiming Wang,Xijian Zhang,Qinglei Guo,Yevhen Yashchyshyn,Qingpu Wang,Yanpeng Shi,Yifei Zhang

DOI: https://doi.org/10.3390/molecules27041336

IF: 4.6

2022-02-16

Molecules

Abstract:With the emergence of fifth-generation (5G) cellular networks, millimeter-wave (mmW) and terahertz (THz) frequencies have attracted ever-growing interest for advanced wireless applications. The traditional printed circuit board materials have become uncompetitive at such high frequencies due to their high dielectric loss and large water absorption rates. As a promising high-frequency alternative, liquid crystal polymers (LCPs) have been widely investigated for use in circuit devices, chip integration, and module packaging over the last decade due to their low loss tangent up to 1.8 THz and good hermeticity. The previous review articles have summarized the chemical properties of LCP films, flexible LCP antennas, and LCP-based antenna-in-package and system-in-package technologies for 5G applications, although these articles did not discuss synthetic LCP technologies. In addition to wireless applications, the attractive mechanical, chemical, and thermal properties of LCP films enable interesting applications in micro-electro-mechanical systems (MEMS), biomedical electronics, and microfluidics, which have not been summarized to date. Here, a comprehensive review of flexible LCP technologies covering electric circuits, antennas, integration and packaging technologies, front-end modules, MEMS, biomedical devices, and microfluidics from microwave to THz frequencies is presented for the first time, which gives a broad introduction for those outside or just entering the field and provides perspective and breadth for those who are well established in the field.

chemistry, multidisciplinary,biochemistry & molecular biology
Chip-Package and Antenna Co-Design of a Tunable UWB Transmitter in System-on-Package with On-Chip versus Off-Chip Passives

Nejad, M.B.,Tenhunen, H.,Li-Rong Zheng

DOI: https://doi.org/10.1109/ESTC.2006.280013

2006-01-01

Abstract:In this paper we present a self-powered CMOS ultra wideband radio transmitter integrated in a liquid-crystal polymer (LCP) based system on package (SoP) module with an embedded small antenna. Chip-package-antenna co-design is performed for this module in the presence of unwanted packaging parasitic effects and optimizes the transmission efficiency. Our contribution includes new modeling of the RF-package and antenna and co-optimizing the chip and package design with on-chip versus off-chip passives trade-offs. The SoP module consists of an innovative tunable low power CMOS transmitter for IR-UWB communication, a double-slotted small-size embedded UWB antenna, and a power converter. The output amplitude and duration of the transmitter can be tuned to transmit a signal meeting the FCC mask in different pulse repetition rate for long and short range applications. This ability can also be used to compensate the process and temperature variations as well as the parasitic effects of packaging and antenna. The antenna has a return loss of better than -10dB. The power converter consists of a chain of surface mounted Schottky diodes and capacitors, which converts incident electromagnetic waves to DC supply and thus power up the transmitter. The final module is implemented in LCP substrate with integrated passive components and embedded antenna. The chip part is implemented in 0.18mum CMOS process
SiP-based 60ghz 4&#x00d7;4 Antenna Array with 90nm CMOS OOK Modulator in LTCC

M. K. Karim,Mengtao Sun,Lawrence Ong,Yong‐Xin Guo,James Brinkhoff,Kai Kang,Fujiang Lin

DOI: https://doi.org/10.1109/mwsym.2010.5517167

2010-01-01

Abstract:A 60GHz 4×4 circular polarized (CP) patch array antenna with a 90nm CMOS OOK modulator are designed and integrated in low temperature cofired ceramic (LTCC) substrate to form a SiP-based transmitter. By applying a stripline sequential rotation feeding scheme, the CP array exhibits a wide impedance bandwidth (VSWR<2) and 3dB axial ratio (AR) bandwidth, both over 8GHz. It has a beam-shaped pattern with a 3dB beamwidth of 20° and a peak gain of 16.8dBi. The CMOS modulator includes a 60GHz oscillator and switchable amplifiers to provide the OOK modulation. By applying a bond wire compensation scheme and low-loss transition optimization, the CMOS modulator is successfully integrated into the package with 2mil 500µm long bond wires. The final fabricated prototype measures only 22×13×1.4mm 3 . The 60GHz SiP transmitter is tested with a commercial receiver and a data rate of 2Gbps is demonstrated. The energy usage at 2Gb/s is only 13.2pJ/bit for the modulator.
Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter

Xuanhe Wei,Youming Miao,Xiao Jin,Tian Hong Loh,Gui Liu

DOI: https://doi.org/10.3390/s24216994

IF: 3.9

2024-10-31

Sensors

Abstract:This paper proposes a novel System-in-Package (SiP) integrated architecture that incorporates Silicon-On-Insulator (SOI) switches and Surface Acoustic Wave (SAW) filters within the chip, aiming to fulfill the demands for miniaturization and multi-functionality for application in emerging wireless technologies. The proposed architecture not only reduces the integration complexity but also considers the architectural design of the integrated module, impedance matching techniques, and signal integrity for carrier aggregation (CA) technology realization. The feasibility of employing SOI switches and SAW filters based on SiP design has been validated through the trial production of a Sub-3GHz radio frequency (RF) front-end diversity receiver module. The resulting RF front-end module demonstrates exceptionally high packaging density and enhanced communication reliability, rendering it suitable for diverse applications in miniaturized RF systems.

engineering, electrical & electronic,chemistry, analytical,instruments & instrumentation
Liquid Crystals for Advanced Smart Devices with Microwave and Millimeter‐Wave Applications: Recent Progress for Next‐generation Communications

Junseok Ma,Jinyoung Choi,Sungeun Park,Imbo Kong,Daehyeon Kim,Cheonga Lee,Youngno Youn,Myeonggin Hwang,Seungwon Oh,Wonbin Hong,Wooksung Kim

DOI: https://doi.org/10.1002/adma.202302474

IF: 29.4

2023-05-26

Advanced Materials

Abstract:Liquid crystals (LCs) technology have a well‐established history of applications in visible light, particularly in the display industry. However, with the rapid growth in communication technology, LCs have become a topic of current interest for high‐frequency microwave (MW) and millimeter‐wave (mmWave) applications due to promising characteristics such as tunability, continuous tuning, low losses, and price compatibility. To improve the performance of future communication technology using LCs, it is not sufficient only with the perspective of radio‐frequency (RF) technology. Therefore, it is imperative to understand not only the novel structural designs and optimization of MW engineering but also the perspective of materials engineering when implementing advanced RF devices with maximum performance for next‐generation satellite and terrestrial communication. Herein, based on advanced nematic LCs, polymer‐modified LCs, dual‐frequency LCs, and photo‐reactive LCs, this article summarizes and examines the modulation principles and key research directions for the design strategies of LCs for advanced smart RF devices with improved driving performance and novel functionality. Furthermore, the challenges in development of state‐of‐the‐art smart RF devices that use LCs are discussed. This article is protected by copyright. All rights reserved

materials science, multidisciplinary,chemistry, physical,physics, applied, condensed matter,nanoscience & nanotechnology

SoP Design on Liquid Crystal Polymer Substrate for 5 GHz RF Receiver Front-End Module

Chip Package Co-design of 5ghz RF Receiver Front-End Using Multichip Module Technology

Design and implementation of a 5GHz RF receiver front-end in LCP based system-on-package module with embedded chip technology

Design of efficient filter on liquid crystal polymer substrate for 5 GHz wireless LAN applications

A 0.5-8Ghz Reconfigurable CMOS RF Receiver Front-end for CR and DPA Applications

Chip-Package Codesign Of Receiver Front End Modules For Rf/Wireless Applications

Progress on Liquid Crystal Polymer for High Frequency Applications

Plasmonic‐Enhanced Polymer‐Stabilized Liquid Crystals Switching for Integrated Optical Attenuation

High performance RF-microwave multilayer integrated components for wireless applications

Liquid Crystal Polymer: Potential Bio-Compatible Substrate for Antenna Application

A Multi-functional Frequency Selective Polarization Converter Based on Substrate Integrated Waveguide Cavities

Design of hybrid structure for fast and deep surface plasmon polariton modulation.

Chip-package co-design of a concurrent LNA in system-on-package for multi-band radio applications

Menis Siob Design For Integrated Transceiver Application

A 2.5D Integrated L Band Receiver Based on High Resistivity Si Interposer

A Novel 3-D Frequency Selective Structure for Radiation Leakage Suppression in Sub-6G Highly Integrated Package

Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies

Chip-Package and Antenna Co-Design of a Tunable UWB Transmitter in System-on-Package with On-Chip versus Off-Chip Passives

SiP-based 60ghz 4&amp;#x00d7;4 Antenna Array with 90nm CMOS OOK Modulator in LTCC

Design of a Novel SiP Integrated RF Front-End Module Based on SOI Switch and SAW Filter

Liquid Crystals for Advanced Smart Devices with Microwave and Millimeter‐Wave Applications: Recent Progress for Next‐generation Communications

SiP-based 60ghz 4×4 Antenna Array with 90nm CMOS OOK Modulator in LTCC