Abstract:In abrasive machining of monocrystalline silicon, surface and subsurface behaviors are changed by the brittle-to-ductile removal transfer due to uncertain mechanical force, thus leading to surface micro-burr, surface roughness, subsurface residual stress, subsurface damage and so on. In mechanical diamond grinding, an impulse-discharge between wheel metal and semiconductor silicon is proposed to drive a loose-abrasive flow along with the flexible pressure for nano-scale surface removal, micro-scale mechanical removal and thermal modification. The formation behavior of abrasive-Si interface is researched to improve the surface and subsurface integrity by integrating modification, flexible removal and cut-copying. First, the surface formation procedure was modelled in relation to impulse-discharge energy, hydrodynamic pressure and loose-abrasive diameter, etc. Then, the dynamic characteristic of fixed-diamond, loose-abrasive machining as well as impulse-discharge machining was investigated in relation to the ductile-brittle transition. Finally, the surface integrity of monocrystalline silicon was investigated in hybrid machining. It is shown that the hybrid machined formation chain is formed in the abrasive-workpiece interface with cut-copying the surface profile. The impulse-discharge drives the loose-abrasive and modifies the interface by thermal ductile transition. The loose-abrasive obtains a removal force to eliminate the modified Si–O bond and expose the Si2p3/2, Si2p1/2 substrate with ductile formation. Decreasing the impulse-discharge energy and hydrodynamic pressure promote brittle to ductile transition for high surface and subsurface integrity. Accordingly, the surface integrity is subject to impulse-discharge energy, hydrodynamic pressure and loose-abrasive size. With the thermal tensile and abrasive driven effect of impulse-discharge, the residual compressive stress, surface micro-burr and subsurface damage thickness were decreased by 72 %, 65 % and 88 %, respectively. As a result, the mechanical cut-copying with impulse-discharge thermal modifying action and abrasive flow driving ensures the surface integrity and form accuracy in process.

Atomistic Simulation on the Removal Mechanism of Monocrystal Silicon Carbide with Textured Surface Nano-Machining in Water Lubrication

Quantitative Analysis of Grinding Performance of Cubic Silicon Carbide Surface Texture Lubricated with Water Film

Molecular dynamics study of the removal mechanism of SiC in a fixed abrasive polishing in water lubrication

Understanding of the effect of wear particles removal from the surface on grinding silicon carbide by molecular dynamics simulations

Atomic simulation of textured silicon carbide surface ultra-precision polishing

A Numerical Analysis of Ductile Deformation during Nanocutting of Silicon Carbide via Molecular Dynamics Simulation

Wear mechanism in nano polishing of SiCp/Al composite materials using molecular dynamics

Molecular Dynamics Simulations of Nano Grinding of Silicon Carbide (Sic)

Investigate on Material Removal of 3C-Sic Crystals in Nano-Polishing Via Molecular Dynamics

Atomic Understanding of the Plastic Deformation Mechanism of 4H-Sic under Different Grain Depth-of-cut During Nano-Grinding

Numerical simulation of single abrasive grain grinding of silicon carbide surface

Analysis of the high-efficiency and low-damage abrasive processing mechanism for SiC based on the SPH simulation of single-grain indentation and scratching

Surface and Subsurface Integrity of Monocrystalline Silicon in Impulse-Discharge Driven Abrasive Machining

Nano and Sub-nano Scale Friction Behavior in Rotary Processing of 6H-Sic with Different Off-Axis Angles

Material removal mechanism and grinding force modelling of ultrasonic vibration assisted grinding for SiC ceramics

Surface Characteristics and Material Removal Mechanisms During Nanogrinding on C-face and Si-face of 4H-Sic Crystals: Experimental and Molecular Dynamics Insights

Impact of multiple abrasive particles on surface properties of SiC: A molecular dynamics simulation study

Molecular Dynamics Simulation of Ultra-Precision Machining 3C-Sic Assisted by Ion Implantation

Simulation of Nano-Grinding of GaN Textured Surface under Ionic Liquids Lubrication

Effect of picosecond laser texturing on the friction behavior of silicon carbide in hybrid ceramic bearings under dry and water lubrication

Atomistic Study of Nano-Cutting Bicrystal Cubic Silicon Carbide