Enhanced Ti3AlC2/Zircaloy-4 Interfacial Bonding by Using Copper As an Interlayer

Bo Yang,Chun Li,Xiaoyang Wang,Hao Yuan,Mingshen Li,Xiaoqing Si,Junlei Qi,Jian Cao
DOI: https://doi.org/10.1016/j.msea.2023.144914
IF: 6.044
2023-01-01
Materials Science and Engineering A
Abstract:We propose a novel strategy for the high-strength joining of Ti3AlC2 and Zircaloy-4 by introducing copper as an interlayer. The interfacial microstructure reveals spontaneously formed Cu–Zr eutectic liquid phase wet Ti3AlC2 ceramic, generating a ZrC layer instead of brittle ZrxAly at the interface, enhancing the Ti3AlC2/Zircaloy-4 joint strength.
What problem does this paper attempt to address?