Abstract:A new non-destructive activation process before electroless nickel plating (ENP) was proposed, which reduced the use of strong corrosive drugs and noble metals, and was environmentally friendly without damaging the surface of alumina ceramics. The process successfully attached nickel nanoparticles firmly to the alumina ceramic surface and used the nickel nanoparticles as a catalytic center of ENP for electroless plating. The important parameters of the non-destructive activation process were optimized by orthogonal experiments. A scanning electron microscope (SEM), an X-ray photoelectron spectroscopy (XPS), an energy dispersive spectrometer (EDS) and thermal shock tests were used to characterize and analyzed the surface morphology, microstructure, composition and binding force of the coating, and measured the plating rate and conductivity to analyze the coating quality. The rate of ENP reduced with the decrease of ion concentration. When the plating time was 30 ,60 and 90 min, the average plating rate was 10.93, 10.85 and 8.76 μm/h, respectively. The difference in the square resistance of the coating of different samples was small, indicating that the coating thickness was basically the same. When the coating was applied for 90 min, the coating thickness was about 14.3 μm and the resistivity was about 107.2 × 10−6 Ω·cm, conforming to the international standard of nickel plating with phosphorus. Therefore, the process has advantages of simple operation and low cost, and it is a non-destructive and environmentally friendly activation process for substrates.

Noise Energy Adopted to Understand Nickel Electroplating Process

In-situ Monitoring of Nickel Electrodeposit Structure Using Electrochemical Noise Technique

Investigation of the Correlation Between the Electrochemical Noise Energy and the Deposit Structure

Study of the Zinc Electroplating Process Using Electrochemical Noise Technique

A Comparative Study Of Nickel(Ii) Removal From Electroplating Wastewater By Pre-Precipitation Combined With Fenton-Precipitation Or Fenton-Like-Precipitation

Study of tin electroplating process using electrochemical impedance and noise techniques

A Preliminary Study of the Relationship Between Zinc Deposit Morphology and Electrocrystallization Noise

Nickel Speciation of Spent Electroless Nickel Plating Effluent along the Typical Sequential Treatment Scheme.

A new environmentally friendly non-destructive activation process of electroless nickel plating on alumina ceramics

Electrodeposition of Ni from Choline Chloride/Ethylene Glycol Deep Eutectic Solvent and Pure Ethylene Glycol

Influencing Factors on the Uniformity of Electroless Nickel Plating on Cenospheres

Electrochemical co-deposition of carbon nanotube/Ni composite layer

Novel Electroless Nickel Plating Process

Electrodeposition and Characterization of Nano-Structured Black Nickel Thin Films

Electroplating Behavior of Zn-Ni Alloys in an Alkaline Electrolyte

Potentiostatic Electrochemical Noise Analysis of 2101 Lean Duplex Stainless Steel in 1 mol/L NaCl

Optimizing Nickel Electroplating in Low-Ni Environments for Efficient Source Production in Small Plating Baths

Electrochemical noises of LC4, LY12 and pure Al in NaCl solution

ZINC-NICKEL ALLOY ELECTROPLATING IN AN ALKALINE BATH

Experimental study on the treatment of highly concentrated electroplating nickel-containing waste liquid by electrolytic method

Optimization of the Preparation Parameters of High-Strength Nickel Layers by Electrodeposition on Mild Steel Substrates