Study on Copper Interconnection Structure of Flexible Electronics by Ag-PT Composite Membrane Induced Electrodeposition

Li Jiujuan,Zhao Hongwei,Zhou Guoyun,Wu Hong,He Wei,Chen Yuanming,Tang Yao,Zhang Huaiwu,Huang Yunzhong,Sun Yukai,Zhu Yongkang
DOI: https://doi.org/10.1007/s10854-022-09685-6
2023-01-01
Journal of Materials Science Materials in Electronics
Abstract:In this paper, a silver-containing polythiophene (Ag-PT) composite membrane is developed by the mixed oxidant of KMnO4 and AgNO3. The formed composite layer exhibits good electrical conductivity and outstanding electrochemical performance with a work function of 4.605 eV and a sheet resistance of 1.86 kΩ/□. The composite membrane is able to induce direct electrodeposition of copper lines or patterns on flexible insulating substrates, which is an alternative route to the electroless deposition of copper layer. The electroplated copper layer on the composite membrane displays a concrete morphology and thus good adhesion to the substrate, which can be employed for electrical interconnection between components. Moreover, the copper layer electrodeposited on the Ag-PT composite membrane is capable of maintaining the conductive loop with the power supply to light up multiple LED devices after 1000 times (± 180°) of bending the flexible substrate. It is found that the composite membrane with porous structure contributes to the improvement of adhesion between the coating and the substrate.
What problem does this paper attempt to address?