Temperature Effects on the Mode II Delamination Propagation Behavior of Aerospace-Grade CFRP Multidirectional Laminates

Yu Gong,Linfeng Jiang,Hansong Zhang,Ziming Wang,Ning Hu
DOI: https://doi.org/10.1080/15376494.2022.2152143
2024-01-01
Mechanics of Advanced Materials and Structures
Abstract:Composite laminates are prone to occur delamination. Currently, there is still lacking research on the temperature effect on mode II delamination of laminates, especially the multidirectional ones. Systematically experimental and numerical studies are conducted here. Delamination tests are performed at four temperatures (-50 degrees C, 23 degrees C, 80 degrees C and 130 degrees C) on aerospace-grade T800/epoxy multidirectional laminates using an end-notched flexure set-up. Pre-cracked and non pre-cracked fracture toughness, and R-curves are measured. The non pre-cracked fracture toughness is affected by temperature. Their values at -50 degrees C, 23 degrees C and 80 degrees C are relatively close to each other while the value at 130 degrees C is 34.14% lower than that at 23 degrees C. The pre-cracked fracture toughness exhibits negligible dependence on temperature and is significantly higher than the non pre-cracked one. R-curve phenomena are observed in specimens evaluated at different temperatures, which exhibit a good linear increase with the increase in delamination length. The R-curves measured at -50 degrees C similar to 80 degrees C are similar while significantly higher than that at 130 degrees C. In addition, the bridging stress is lower when the temperature is between -50 degrees C and 23 degrees C, compared to those at high temperatures of 80 degrees C and 130 degrees C. Numerical framework for simulating the mode II delamination growth behavior is established based on the cohesive zone model. Predicted results show that the reasonable interfacial strength of cohesive elements first increases and then decreases with the increase in temperature. Temperature effect on the damage area around crack tip is also revealed.
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