Effect of the Surface Activation Parameter on the Fabrication Process of 4h–sic Film on SiO2/Si Using the Crystal‐Ion‐Slicing Technique

Dailei Zhu,Wenbo Luo,Kaibiao Wang,Jintao Xu,Shitian Huang,Yao Shuai,Chuangui Wu,Wanli Zhang
DOI: https://doi.org/10.1002/pssa.202200028
2023-01-01
Abstract:4H–silicon carbide on silicon (4H–SiC on Si) fabricated by crystal‐ion‐slicing (CIS) technology can be served as an integration platform for optoelectronic devices and composite substrate for gallium nitride heteroepitaxy. The bonding strength of 4H–SiC on Si is closely related to the surface activation parameter, which finally impacts the fabrication process. Herein, 1.2 μm thick 4H–SiC single crystal film has been successfully transferred onto Si substrate by CIS technology. The mechanism of bonding strength enhanced by plasma activation is studied, and the effect of bonding strength on the exfoliating process of film is analyzed. High bonding strength obtained under the O2 90 s activation condition makes the film have a more compact interface, and the characterizations of morphology and structure confirm the smooth surface and single crystal quality. These results provide a possibility for optoelectronic integration and growth of gallium nitride on the heterogeneous substrate.
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