Mechanism of Ultrahigh Ductility Obtained by Globularization of Αgb for Additive Manufacturing Ti–6Al–4V

Yusen Xiao,Liang Lan,Shuang Gao,Bo He,Yonghua Rong
DOI: https://doi.org/10.1016/j.msea.2022.144174
2022-01-01
SSRN Electronic Journal
Abstract:In the present work, two post-processes, the 800 degrees C and 950 degrees C for 4 h annealing below 8 transus, were designed to improve the performance of selective laser melted (SLM) Ti-6Al-4V (Ti64) alloy. The results show that 800 degrees C annealing raises the ductility to 18%, while 950 degrees C annealing raises the ductility high up to 26%. Although the residual stress relief and martensite decomposition fully accomplished in both annealed samples, there is still a noticeable difference in ductility. The difference is due to that 950 degrees C annealing induce noticeable globulari-zation which further alters the fracture mode. Further study indicates that with globularization of alpha GB phase (alpha phase along prior 8 grain boundary), the transgranular fracture replaces the detrimental intergranular fracture. Particularly, the high angle grain boundary (HAGB) between equiaxed alpha GB phase effectively inhibits the initi-ation and propagation of crack, when comparing to the low angle grain boundary (LAGB) in alpha lamella. The reason for globularization in 950 degrees C annealing could be concluded as the boundary splitting model. The 8 phase grow along the LAGB in alpha lamella and form thermal grooving. With the groove deepening, the lamella was separated into equiaxed alpha phase. In this process, high temperature annealing promotes sufficient bulk diffusion, which is a necessary condition for globularization of lamellar alpha phase in SLM Ti64 alloy.
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