Single-event Burnout Hardening of RC-IGBT with the Raised N-buffer Layer

Xiao-Dong Zhang,Ying Wang,Xing-ji Li,Jian-qun Yang,Fei Cao,Meng-Tian Bao
DOI: https://doi.org/10.1016/j.microrel.2022.114808
IF: 1.6
2022-01-01
Microelectronics Reliability
Abstract:This paper proposes a reverse conducting insulated gate bipolar transistors (RC-IGBT) structure with a raised N -buffer layer (RNB-IGBT) to improve the single-event burnout (SEB) robustness. The electrical and radiation properties of the structure were verified by TCAD simulations. At the same snapback voltage of 0.22 V and the liner energy transfer (LET) of 60 MeVcm2/mg conditions, the SEB threshold of RNB-IGBT is improved by 52 % compared to that of conventional RC-IGBT. This result indicates that the raised N-buffer layer of the RNB-IGBT can effectively reduce impact ionization, so it can suppress excessive heat concentration and avoid induce SEB.
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