Experimental and Multiphysics Simulation Study of Atoms Migration and Morphology Evolution in Electronic Package

Fei Jia,Leyi Niu,Yuchen Xi,Yuanying Qiu,Hongbo Ma,Chengpeng Yang

DOI: https://doi.org/10.2139/ssrn.4216196

2022-01-01

SSRN Electronic Journal

Abstract:Voids in solder joints induced by electromigration significantly affect mechanical and electrical properties of materials, causing performance degradation and reduction in durability of electronic device. In this study, atoms migration behavior and both voids formation and heat transfer characteristics under high current density are investigated by experiments and dynamic multiphysics simulations. In experiments, the solder joint voltage and temperature distribution are measured in situ. Besides, X-ray CT images are utilized to observe morphology of solder joints and quantitively analyze the volume, surface area and size distribution of voids. The experimental results show that during electromigration process voltage variation of the joint can be divided into three stages: voids incubation, voids propagation and steady period. 3D image of the sample is reconstructed and shows that voids mainly appear with small size and distribute near the inlet of electron flow. With the increase of voids volume and area, the number of voids significantly decreases; while the number of the voids falls slowly as the equivalent diameter increases and most voids diameter lay within the range of 1-10 μm. Meanwhile, a three dimensional model of the package combined atoms diffusion, transient heat transfer, current density, and mechanical response is developed. The model is validated by experimental results and modeling results show that atoms migrate from the cathode to the anode, causing current crowding to occur and the maximum values of tensile stress and temperature at the cathode side to locate at voids region. With the decrease of atomic concentration at the cathode, voids propagate and block heat transfer path, leading to much uneven heat flux distribution and higher thermal resistance of the bump. Considering the effect of voids space on microstructure of the bump, voids growth in the bump is accelerated, thus the rate of voids propagation is improved and the electromigration failure occurs earlier.