Abstract:Voids in solder joints induced by electromigration significantly affect mechanical and electrical properties of materials, causing performance degradation and reduction in durability of electronic device. In this study, atoms migration behavior and both voids formation and heat transfer characteristics under high current density are investigated by experiments and dynamic multiphysics simulations. In experiments, the solder joint voltage and temperature distribution are measured in situ. Besides, X-ray CT images are utilized to observe morphology of solder joints and quantitively analyze the volume, surface area and size distribution of voids. The experimental results show that during electromigration process voltage variation of the joint can be divided into three stages: voids incubation, voids propagation and steady period. 3D image of the sample is reconstructed and shows that voids mainly appear with small size and distribute near the inlet of electron flow. With the increase of voids volume and area, the number of voids significantly decreases; while the number of the voids falls slowly as the equivalent diameter increases and most voids diameter lay within the range of 1-10 Î¼m. Meanwhile, a three dimensional model of the package combined atoms diffusion, transient heat transfer, current density, and mechanical response is developed. The model is validated by experimental results and modeling results show that atoms migrate from the cathode to the anode, causing current crowding to occur and the maximum values of tensile stress and temperature at the cathode side to locate at voids region. With the decrease of atomic concentration at the cathode, voids propagate and block heat transfer path, leading to much uneven heat flux distribution and higher thermal resistance of the bump. Considering the effect of voids space on microstructure of the bump, voids growth in the bump is accelerated, thus the rate of voids propagation is improved and the electromigration failure occurs earlier.

Study of Migration and Coalescence of Voids Driven by Electric Current Stressing in Solder Interconnects Using Phase Field Simulation

Numerical Simulations of Migration and Coalescence Behavior of Microvoids Driven by Diffusion and Electric Field in Solder Interconnects

Coupled Phase Field And Finite Element Modeling Of Void Evolution And Physical Property Change Of Micro Flip-Chip Solder Joints Under Electromigration And Elastic Stress Field

Morphological Evolution And Migration Behavior Of The Microvoid In Sn/Cu Interconnects Under Electrical Field Studied By Phase-Field Simulation

Phase Field Simulation of Morphological Evolution and Migration of the Microvoid in Small Scale Solder Interconnects Driven by Temperature Gradient

Phase-Field Modelling of Lead-Free Solder Joint Void Growth under Thermal-Electrical Coupled Stress

Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density

Experimental and Multiphysics Simulation Study of Atoms Migration and Morphology Evolution in Electronic Package

An Electro-Thermo-mechanical Coupling Phase-Field Model of Defect Evolution Induced by Electromigration in Interconnects

Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation

Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

Finite Element Analysis of Stress-Induced Voiding in Copper Interconnects

Phase-Field-Crystal Model for Electromigration in Metal Interconnects.

Electromigration-induced void evolution and failure of Cu/SiCN hybrid bonds

Phase Field Study of the Combined Effects of Electromigration and Thermomigration on Phase Segregation and Physical Properties of Sn58Bi Solder Joints under Electric Current Stressing Coupled with Temperature Gradient

Phase Field Simulation of the Microstructural Evolution and Electromigration-Induced Phase Segregation in Line-Type Cu/Sn-Bi/Cu Solder Interconnects

Modeling of electromigration of the through silicon via interconnects

Study of Electromigration-Induced Formation of Discrete Voids in Flip-Chip Solder Joints by In-Situ 3D Laminography Observation and Finite-Element Modeling

Phase-Field Crystal Simulation on Evolution and Growth Kinetics of Kirkendall Voids in Interface and Intermetallic Compound Layer in Sn/Cu Soldering System

Effects of Stress and Temperature Gradients on the Evolution of Void in Metal Interconnects Driven by Electric Current and Mechanical Stress

Phase Field Simulation of Electromigration-induced Failure in TSV Interconnect