Nanosecond Laser-Induced Surface Modification to Strengthen Cu/Si3N4 AMB Joints

Jian Cao,Yanyu Song,Haitao Zhu,Xingyi Li,Tao Wang,Xiaoguo Song,Caiwang Tan,Duo Liu
DOI: https://doi.org/10.1016/j.msea.2022.143573
2022-01-01
Abstract:The enhanced technology of laser surface modification was developed to improve the mechanical properties of Cu/Si3N4 AMB joints in this work. The application of laser modification enabled the fabrication of periodic micro-grooves arrays with Si precipitates contained on the Si3N4. The bonding behavior and strengthening mechanism of the joints with laser modification are investigated by means of thermodynamic analysis and finite element simulation. The introduction of Si precipitates on the laser-modified Si(3)N(4 )surface could facilitate the atomic diffusion in the bonding and improve the kinetic behavior of the joints. Large amounts of Ti5Si3 particles were produced at the interface adjacent to Si(3)N(4 )preferentially. Finite element results demonstrated that the wave-like interfacial structure of the joints could decrease and redistribute the residual stress field in the interface, providing a method for improving the mechanical properties of the joint. The maximum shear strength of joints with the laser modification was 64.6 MPa, which was approximately 200% higher than that of the un-treated joints.
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