Effect of Twin Spacing on Coefficient of Thermal Expansion of (111)-Oriented Nano-Twinned Copper: A Molecular Dynamics Simulation Study

Shan Lu,Yunwen Wu,Tao Hang,Ming Li

DOI: https://doi.org/10.1109/icept56209.2022.9873229

2022-01-01

Abstract:Nano-twinned Cu has been reported as a promising candidate for future interconnect materials in 3D packaging due to its high mechanical and electrical performance. However, the huge mismatch of coefficient of thermal expansion (CTE) between Cu and Si will induce thermal stress in Through-silicon via (TSV), leading to severe reliability issues. In this study, molecular dynamics (MD) simulation is used to study the thermal expansion behavior of nano-twinned Cu from 300 K to 800 K. (111)-oriented nano-twinned Cu single crystal and columnar crystal models with different twin spacings were designed to clarify the influence of twin spacing on CTE. At 600 K, the CTE of nano-twinned single crystal Cu with 0.625 nm twin spacing and single crystal Cu are 17.83×10 -6 /K and 17.59×10 -6 /K. And the CTE of nano-twinned columnar polycrystalline Cu is stable at 17.50×10 -6 /K. The simulation results indicate the twin boundaries in Cu promote thermal expansion and improve the thermal stability compared with normal grain boundary.