Performance Enhancement of Nonvolatile Resistive Switching Memory device Made from WO<sub>X</sub>/ZnO Bilayer Structure

Qi Xue,Liang Cao,Ke Zhang,Huiqin Ling,Yunwen Wu,Ming Li,Tao Hang
DOI: https://doi.org/10.1109/icept56209.2022.9872667
2022-01-01
Abstract:Among the various emerging storage technologies, resistive random-access memory (RRAM) has been identified as the most potential competitor for future application of nonvolatile information storage and neuromorphic computing. However, the reliability and performance of the device are still a considerable challenge. Here, a bilayer oxide structure WO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</inf> /ZnO was applied as the functional layer of the RRAM. The WO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</inf> layer prepared by physical deposition act as the oxygen vacancy source, and the ZnO layer fabricated by the combustion method serves as the resistive switching layer. Through oxygen vacancy engineering, the Pt/WO <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</inf> /ZnO/ITO exhibits outstanding performance, including extremely low programming voltage (0.7 V/−0.3 V), desirable memory window (˃10 <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ), and enhanced device reliability. This work provides a feasible method to optimize device performance and is expected to facilitate the commercialization of RRAM devices.
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